MPC860TVR50D4 vs MPC860TCVR50D4 Comparação

Comparação detalhada lado a lado de MPC860TVR50D4 por NXP Semiconductors e MPC860TCVR50D4 por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MPC860TVR50D4 MPC860TVR50D4 - 50MHz PowerQUICC MPU 357-PBGA | NXP

MPC860TVR50D4 - 50MHz PowerQUICC MPU 357-PBGA | NXP

MPC860TVR50D4 Obsolete
NXP Semiconductors
MPC860TCVR50D4 MPC860TCVR50D4 - 50MHz 32-Bit PowerQUICC MPU | NXP

MPC860TCVR50D4 - 50MHz 32-Bit PowerQUICC MPU | NXP

MPC860TCVR50D4 ✗ Fim de vida

Comparação de especificações

Parâmetro MPC860TVR50D4 MPC860TCVR50D4
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida Obsolete Fim de vida
Status do estoque In Stock In Stock
Preço unitário (USD) $58,00 $0,00
Core Architecture PowerPC 32-bit —
Core Count 1 1 core
Frequência máxima de clock 50 MHz —
Operating Supply Voltage (Core) 3.3 V —
Operating Supply Voltage (I/O) 3.3 V —
Encapsulamento / Caixa 357-PBGA (25x25 mm) —
Process Technology 0.32 µm CMOS 0.32 micrometer
Instruction Cache 4 Kbyte —
Data Cache 4 Kbyte —
Integrated Communications Module (CPM) Yes (SCC, SMC, SPI, I²C, UART) —
PCMCIA Interface Yes (Type I/II) —
Memory Controller DRAM, SRAM, EPROM, Flash —
Faixa de temperatura de operação -40°C to +95°C —
Tipo de montagem Surface Mount (BGA) Surface mount
Series MPC8xx PowerQUICC —
Status RoHS [DATA_NEEDED: rohs compliance] RoHS compliant
Lead-Free / Reflow Profile [DATA_NEEDED: reflow profile] —
Processor Type — MPC8xx PowerQUICC 32-bit microprocessor
Processor Architecture — RISC, 32-bit
Operating Speed — 50 MHz
Tensão de alimentação — 3.3 V
Encapsulamento — 357-pin PBGA, 25 x 25 mm
Package Type — 357-BBGA
Packaging — Tray
Lead-Free Status — Lead free
Application Category — Communications and networking controllers
Temperatura de operação — [DATA_NEEDED: operating temperature range]
Memory Configuration — [DATA_NEEDED: internal and external memory configuration]
I/O Interfaces — [DATA_NEEDED: communications and peripheral interfaces]
Power Consumption — [DATA_NEEDED: power consumption conditions]
Clocking and Reset — [DATA_NEEDED: clock and reset requirements]
Pinout — [DATA_NEEDED: complete 357-ball assignment]

Fichas técnicas e recursos

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