MPC862PCZQ66B vs MPC862PZQ66B Comparación
Comparación detallada lado a lado de MPC862PCZQ66B por NXP Semiconductors y MPC862PZQ66B por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC862PCZQ66B - PowerQUICC 32-Bit 66MHz MPU | NXP | 357-BGA
MPC862PCZQ66B ⚠ Última compraNXP Semiconductors
MPC862PZQ66B - 66MHz PowerQUICC MPU, 357-PBGA | NXP Semiconductors
MPC862PZQ66B ObsoleteComparación de especificaciones
| Parámetro | MPC862PCZQ66B | MPC862PZQ66B |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Última compra | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $84,75 | $62,10 |
| Processor Type | MPC8xx PowerQUICC 32-Bit | MPC8xx PowerQUICC 32-Bit MPU |
| Core Architecture | Power Architecture (MPC8xx family) | PowerPC + CPM (QUICC) |
| Speed (CPU Clock) | 66 MHz | — |
| Tensión de alimentación | 3.3 V | — |
| Number of Cores | 1 | 1 |
| Bit Width | 32-Bit | — |
| Number of I/O | [DATA_NEEDED: I/O count] | — |
| Encapsulado / Carcasa | 357-BBGA (PBGA 25x25 mm) | 357-BBGA (PBGA, 25 x 25 mm) |
| Packaging | Tray | Tray |
| Process Technology | 0.32 µm CMOS | — |
| Temperatura de funcionamiento | -40 °C to +105 °C | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Lead Free Status | Contains Lead (per DigiChip spec summary) | Contains Lead |
| Estado RoHS | Non-RoHS (legacy PowerQUICC) | Non-compliant per third-party listing (Contains Pb) |
| Communication Peripherals | FCC, SCC, SMC, SPI, I²C, PCMCIA / PC Card, Ethernet | — |
| Integrated Features | MMU, instruction/data caches, system integration unit | — |
| Manufacturer | — | NXP Semiconductors |
| Ancho del bus de datos | — | 32-bit |
| Maximum Clock Speed | — | 66 MHz |
| Tensión de alimentación de funcionamiento | — | 3.3 V |
| Terminal Form | — | Ball |
| Number of Terminals | — | 357 |
| Package Code | — | BGA (PBGA) |
| Series | — | MPC8xx PowerQUICC |
| Temperature Grade | — | Other (per data sheet) |