MPC862PCZQ66B vs MPC862PZQ66B Comparaison
Comparaison détaillée côte à côte de MPC862PCZQ66B par NXP Semiconductors et MPC862PZQ66B par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC862PCZQ66B - PowerQUICC 32-Bit 66MHz MPU | NXP | 357-BGA
MPC862PCZQ66B ⚠ Dernier achatNXP Semiconductors
MPC862PZQ66B - 66MHz PowerQUICC MPU, 357-PBGA | NXP Semiconductors
MPC862PZQ66B ObsoleteComparaison des spécifications
| Paramètre | MPC862PCZQ66B | MPC862PZQ66B |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Dernier achat | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $84,75 | $62,10 |
| Processor Type | MPC8xx PowerQUICC 32-Bit | MPC8xx PowerQUICC 32-Bit MPU |
| Core Architecture | Power Architecture (MPC8xx family) | PowerPC + CPM (QUICC) |
| Speed (CPU Clock) | 66 MHz | — |
| Tension d'alimentation | 3.3 V | — |
| Number of Cores | 1 | 1 |
| Bit Width | 32-Bit | — |
| Number of I/O | [DATA_NEEDED: I/O count] | — |
| Boîtier / Format | 357-BBGA (PBGA 25x25 mm) | 357-BBGA (PBGA, 25 x 25 mm) |
| Packaging | Tray | Tray |
| Process Technology | 0.32 µm CMOS | — |
| Température de fonctionnement | -40 °C to +105 °C | — |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Lead Free Status | Contains Lead (per DigiChip spec summary) | Contains Lead |
| Statut RoHS | Non-RoHS (legacy PowerQUICC) | Non-compliant per third-party listing (Contains Pb) |
| Communication Peripherals | FCC, SCC, SMC, SPI, I²C, PCMCIA / PC Card, Ethernet | — |
| Integrated Features | MMU, instruction/data caches, system integration unit | — |
| Manufacturer | — | NXP Semiconductors |
| Largeur du bus de données | — | 32-bit |
| Maximum Clock Speed | — | 66 MHz |
| Tension d'alimentation de fonctionnement | — | 3.3 V |
| Terminal Form | — | Ball |
| Number of Terminals | — | 357 |
| Package Code | — | BGA (PBGA) |
| Series | — | MPC8xx PowerQUICC |
| Temperature Grade | — | Other (per data sheet) |