MPC862PZQ66B vs MPC862PCZQ66B Comparación
Comparación detallada lado a lado de MPC862PZQ66B por NXP Semiconductors y MPC862PCZQ66B por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC862PZQ66B - 66MHz PowerQUICC MPU, 357-PBGA | NXP Semiconductors
MPC862PZQ66B ObsoleteNXP Semiconductors
MPC862PCZQ66B - PowerQUICC 32-Bit 66MHz MPU | NXP | 357-BGA
MPC862PCZQ66B ⚠ Última compraComparación de especificaciones
| Parámetro | MPC862PZQ66B | MPC862PCZQ66B |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Obsolete | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $62,10 | $84,75 |
| Manufacturer | NXP Semiconductors | — |
| Processor Type | MPC8xx PowerQUICC 32-Bit MPU | MPC8xx PowerQUICC 32-Bit |
| Number of Cores | 1 | 1 |
| Core Architecture | PowerPC + CPM (QUICC) | Power Architecture (MPC8xx family) |
| Ancho del bus de datos | 32-bit | — |
| Maximum Clock Speed | 66 MHz | — |
| Tensión de alimentación de funcionamiento | 3.3 V | — |
| Encapsulado / Carcasa | 357-BBGA (PBGA, 25 x 25 mm) | 357-BBGA (PBGA 25x25 mm) |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Packaging | Tray | Tray |
| Lead Free Status | Contains Lead | Contains Lead (per DigiChip spec summary) |
| Estado RoHS | Non-compliant per third-party listing (Contains Pb) | Non-RoHS (legacy PowerQUICC) |
| Terminal Form | Ball | — |
| Number of Terminals | 357 | — |
| Package Code | BGA (PBGA) | — |
| Series | MPC8xx PowerQUICC | — |
| Temperature Grade | Other (per data sheet) | — |
| Speed (CPU Clock) | — | 66 MHz |
| Tensión de alimentación | — | 3.3 V |
| Bit Width | — | 32-Bit |
| Number of I/O | — | [DATA_NEEDED: I/O count] |
| Process Technology | — | 0.32 µm CMOS |
| Temperatura de funcionamiento | — | -40 °C to +105 °C |
| Communication Peripherals | — | FCC, SCC, SMC, SPI, I²C, PCMCIA / PC Card, Ethernet |
| Integrated Features | — | MMU, instruction/data caches, system integration unit |