MPC862PZQ66B vs MPC862PCZQ66B Comparaison
Comparaison détaillée côte à côte de MPC862PZQ66B par NXP Semiconductors et MPC862PCZQ66B par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC862PZQ66B - 66MHz PowerQUICC MPU, 357-PBGA | NXP Semiconductors
MPC862PZQ66B ObsoleteNXP Semiconductors
MPC862PCZQ66B - PowerQUICC 32-Bit 66MHz MPU | NXP | 357-BGA
MPC862PCZQ66B ⚠ Dernier achatComparaison des spécifications
| Paramètre | MPC862PZQ66B | MPC862PCZQ66B |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Obsolete | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $62,10 | $84,75 |
| Manufacturer | NXP Semiconductors | — |
| Processor Type | MPC8xx PowerQUICC 32-Bit MPU | MPC8xx PowerQUICC 32-Bit |
| Number of Cores | 1 | 1 |
| Core Architecture | PowerPC + CPM (QUICC) | Power Architecture (MPC8xx family) |
| Largeur du bus de données | 32-bit | — |
| Maximum Clock Speed | 66 MHz | — |
| Tension d'alimentation de fonctionnement | 3.3 V | — |
| Boîtier / Format | 357-BBGA (PBGA, 25 x 25 mm) | 357-BBGA (PBGA 25x25 mm) |
| Type de montage | Surface Mount | Surface Mount (BGA) |
| Packaging | Tray | Tray |
| Lead Free Status | Contains Lead | Contains Lead (per DigiChip spec summary) |
| Statut RoHS | Non-compliant per third-party listing (Contains Pb) | Non-RoHS (legacy PowerQUICC) |
| Terminal Form | Ball | — |
| Number of Terminals | 357 | — |
| Package Code | BGA (PBGA) | — |
| Series | MPC8xx PowerQUICC | — |
| Temperature Grade | Other (per data sheet) | — |
| Speed (CPU Clock) | — | 66 MHz |
| Tension d'alimentation | — | 3.3 V |
| Bit Width | — | 32-Bit |
| Number of I/O | — | [DATA_NEEDED: I/O count] |
| Process Technology | — | 0.32 µm CMOS |
| Température de fonctionnement | — | -40 °C to +105 °C |
| Communication Peripherals | — | FCC, SCC, SMC, SPI, I²C, PCMCIA / PC Card, Ethernet |
| Integrated Features | — | MMU, instruction/data caches, system integration unit |