MPX2100GVP vs MPX2100DP Comparación
Comparación detallada lado a lado de MPX2100GVP por NXP Semiconductors y MPX2100DP por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPX2100GVP - 100 kPa Vented Gauge Pressure Sensor | NXP Semiconductors
MPX2100GVP ✓ ActivoComparación de especificaciones
| Parámetro | MPX2100GVP | MPX2100DP |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Pressure Sensors | Pressure Sensors |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $16,20 | $5,95 |
| Tipo de sensor | Piezoresistive silicon pressure sensor | — |
| Pressure Type | Vented Gauge | Differential |
| Pressure Range | 0 kPa to 100 kPa (0 to 14.5 psi) | — |
| Full-Scale Span (Typical) | 40 mV at 10 V supply | 40 mV (at 10 V excitation) |
| Tipo de salida | Analog voltage (differential Wheatstone bridge) | Analog mV (Wheatstone Bridge) |
| Tensión de alimentación | 10 V typical | 10 V DC typical |
| Corriente de alimentación | 6 mA typical | [DATA_NEEDED: supply current] |
| Temperatura de funcionamiento | -40C to +125C | 0C to +85C (compensated) |
| Port Type | Male 0.19 inch (4.93 mm) tube | — |
| Encapsulado | 4-SIP Module (Case 344B-01) | — |
| Tipo de montaje | Through-Hole | Through-Hole |
| Temperature Compensation | On-chip (laser-trimmed) | — |
| Linearity | Calibrated by manufacturer | 1% typical |
| Estado RoHS | [DATA_NEEDED: rohs status] | Compliant |
| Lead Free | [DATA_NEEDED: lead free status] | — |
| Operating Pressure Range | — | 0 kPa to 100 kPa (0 to 14.5 psi) |
| Maximum Overload Pressure | — | [DATA_NEEDED: maximum overload pressure] |
| Zero Pressure Offset | — | [DATA_NEEDED: zero pressure offset] |
| Storage Temperature | — | [DATA_NEEDED: storage temperature] |
| Port Configuration | — | Dual port, axial tube, 4.93 mm (0.19 in) |
| Encapsulado / Carcasa | — | 4-SIP Module (Case 344C-01) |
| Technology | — | Silicon piezoresistive, on-chip temperature compensation |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |