MPX2100GVP vs MPX2100DP Comparaison
Comparaison détaillée côte à côte de MPX2100GVP par NXP Semiconductors et MPX2100DP par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPX2100GVP - 100 kPa Vented Gauge Pressure Sensor | NXP Semiconductors
MPX2100GVP ✓ ActifComparaison des spécifications
| Paramètre | MPX2100GVP | MPX2100DP |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Pressure Sensors | Pressure Sensors |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $16,20 | $5,95 |
| Type de capteur | Piezoresistive silicon pressure sensor | — |
| Pressure Type | Vented Gauge | Differential |
| Pressure Range | 0 kPa to 100 kPa (0 to 14.5 psi) | — |
| Full-Scale Span (Typical) | 40 mV at 10 V supply | 40 mV (at 10 V excitation) |
| Type de sortie | Analog voltage (differential Wheatstone bridge) | Analog mV (Wheatstone Bridge) |
| Tension d'alimentation | 10 V typical | 10 V DC typical |
| Courant d'alimentation | 6 mA typical | [DATA_NEEDED: supply current] |
| Température de fonctionnement | -40C to +125C | 0C to +85C (compensated) |
| Port Type | Male 0.19 inch (4.93 mm) tube | — |
| Boîtier | 4-SIP Module (Case 344B-01) | — |
| Type de montage | Through-Hole | Through-Hole |
| Temperature Compensation | On-chip (laser-trimmed) | — |
| Linearity | Calibrated by manufacturer | 1% typical |
| Statut RoHS | [DATA_NEEDED: rohs status] | Compliant |
| Lead Free | [DATA_NEEDED: lead free status] | — |
| Operating Pressure Range | — | 0 kPa to 100 kPa (0 to 14.5 psi) |
| Maximum Overload Pressure | — | [DATA_NEEDED: maximum overload pressure] |
| Zero Pressure Offset | — | [DATA_NEEDED: zero pressure offset] |
| Storage Temperature | — | [DATA_NEEDED: storage temperature] |
| Port Configuration | — | Dual port, axial tube, 4.93 mm (0.19 in) |
| Boîtier / Format | — | 4-SIP Module (Case 344C-01) |
| Technology | — | Silicon piezoresistive, on-chip temperature compensation |
| Niveau MSL | — | [DATA_NEEDED: MSL rating] |