MPX2200GP vs MPX2100GP Comparación

Comparación detallada lado a lado de MPX2200GP por STMicroelectronics y MPX2100GP por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

NXP Semiconductors
MPX2100GP MPX2100GP - 100kPa Vented Gauge Pressure Sensor | NXP

MPX2100GP - 100kPa Vented Gauge Pressure Sensor | NXP

MPX2100GP ✓ Activo

Comparación de especificaciones

Parámetro MPX2200GP MPX2100GP
Marca STMicroelectronics NXP Semiconductors
Categoría Pressure Sensors Pressure Sensors
Estado del ciclo de vida Activo Activo
Estado del stock In Stock In Stock
Precio unitario (USD) $14,20 $10,40
Manufacturer STMicroelectronics —
Tipo de sensor Pressure Sensor - Vented Gauge —
Operating Pressure Range 0 kPa to 200 kPa (0 to 29.01 PSI) 0 to 14.5 psi (0 to 100 kPa)
Maximum Overpressure [DATA_NEEDED: maximum overpressure rating] 58.02 psi (400 kPa)
Port Type Male - 0.19 inch (4.93 mm) Tube —
Tipo de salida Analog Wheatstone Bridge Wheatstone Bridge (analog voltage, ratiometric)
Full-Scale Span 0 mV to 40 mV (typical, at 10 V excitation) 40 mV typical at 10 V supply
Excitation Voltage 10 V (typical DC) —
Pressure Reference Vented Gauge (atmospheric backside) —
Temperatura de funcionamiento [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
Bridge Resistance [DATA_NEEDED: input/output bridge resistance] —
Linearity [DATA_NEEDED: linearity percentage] —
Temperature Compensation On-chip (laser-trimmed) On-chip, calibrated
Encapsulado / Carcasa 4-SIP Module (4-344C) —
Tipo de montaje Through-Hole Through-Hole
Port Side Single port —
Estado RoHS Compliant (per distributor listing) unknown
Pressure Type — Vented Gauge
Offset — 0 mV minimum at 0 kPa
Tensión de alimentación — 10 V typical (ratiometric)
Maximum Operating Current — 6 mA
Port Size — Male 0.19 in (4.93 mm) barbed tube
Port Style — Barbed
Encapsulado — 4-SIP Module (Unibody through-hole)
Technology — Silicon piezoresistive, MEMS
Termination Style — PCB (SIP pins)

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