MPXAZ6115AC6U vs MPXAZ6115A7U Comparación
Comparación detallada lado a lado de MPXAZ6115AC6U por NXP Semiconductors y MPXAZ6115A7U por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MPXAZ6115AC6U | MPXAZ6115A7U |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Pressure Sensors | Pressure Sensors |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $8,40 | $10,10 |
| Pressure Type | Absolute | Absolute |
| Operating Pressure Range | 15 kPa to 115 kPa (2.18 PSI to 16.68 PSI) | 2.18 PSI to 16.68 PSI (15 kPa to 115 kPa) |
| Tipo de salida | Analog Voltage | Analog Voltage |
| Rango de tensión de salida | 0.2 V to 4.7 V | 0.2 V to 4.7 V |
| Tensión de alimentación | 5.0 V typical (4.75 V to 5.25 V) | 5.0 V typical |
| Corriente de alimentación | [DATA_NEEDED: supply current typical mA] | — |
| Accuracy | +/-1.5% Vfss (max) | ±1.5% (0C to 85C, after NXP factory calibration) |
| Temperatura de funcionamiento | -40C to +125C | -40C to +125C |
| Port Style | Top Port, Male 0.13" (3.17 mm) Tube | Top axial tube, 0.13" (3.17 mm) diameter |
| Port Type | Single Axial Barbed | — |
| Encapsulado | 8-SMD, Gull Wing, Top Port | — |
| Tipo de montaje | Surface Mount | Through-Hole |
| Media Compatibility | Media Resistant (dry gases, isolated from harsh media) | Non-corrosive dry gases (media resistant) |
| Signal Conditioning | On-chip bipolar op-amp + thin-film resistor networks | On-chip bipolar op-amp + thin-film resistor network |
| Temperature Compensation | Built-in (calibrated across full range) | On-chip, factory calibrated |
| Estado RoHS | Compliant | Compliant |
| Operating Pressure Min | — | 15 kPa |
| Operating Pressure Max | — | 115 kPa |
| Sensitivity | — | [DATA_NEEDED: typical sensitivity mV/kPa] |
| Encapsulado / Carcasa | — | 8-DIP Module (0.560 inch, 14.22 mm) |