MPXV5010GP vs MPX5010GSX Comparación
Comparación detallada lado a lado de MPXV5010GP por STMicroelectronics y MPX5010GSX por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
STMicroelectronics
MPXV5010GP - 0-10 kPa Vented Gauge Pressure Sensor, 8-SMD | STMicroelectronics
MPXV5010GP ✓ ActivoComparación de especificaciones
| Parámetro | MPXV5010GP | MPX5010GSX |
|---|---|---|
| Marca | STMicroelectronics | NXP Semiconductors |
| Categoría | Pressure Sensors | Pressure Sensors |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $9,95 | $10,25 |
| Pressure Type | Vented Gauge | Vented Gauge |
| Pressure Range | 0 kPa to 10 kPa (0 PSI to 1.45 PSI) | — |
| Operating Pressure Max | 10 kPa | — |
| Tipo de salida | Analog Voltage | Analog Voltage |
| Tensión de salida | 0.2 V to 4.7 V | — |
| Tensión de alimentación | 5 V | — |
| Corriente de alimentación | 5 mA typical | [DATA_NEEDED: supply current typical] |
| Sensitivity | 450 mV/kPa (approx, 0.2-4.7 V span) | — |
| Accuracy | [DATA_NEEDED: accuracy %FS] | 1.0 % typical (per datasheet) |
| Temperatura de funcionamiento | 0 C to +85 C | 0 C to 85 C |
| Port Style | Male - 3.17 mm (0.13 in) Tube, Side Port | — |
| Encapsulado | 8-SMD, Gull Wing, Side Port | — |
| Tipo de montaje | Surface Mount | Through Hole |
| Sensor Technology | Piezoresistive (MEMS silicon) | — |
| Signal Conditioning | On-chip, temperature compensated, calibrated | — |
| Output Ratiometric | Yes (output scales with VDD) | — |
| Operating Pressure Range | — | 0 kPa to 10 kPa (0 to 1.45 PSI) |
| Maximum Overload Pressure | — | [DATA_NEEDED: maximum overload pressure] |
| Output Voltage Span | — | 0.2 V to 4.7 V |
| Supply Voltage (VCC) | — | 4.5 V to 5.5 V |
| Response Time | — | [DATA_NEEDED: response time] |
| Port Size | — | Male 0.19 inch (4.93 mm) Tube, Side Port |
| Encapsulado / Carcasa | — | 6-SIP Module (Case 867F) |
| Termination Style | — | Through-Hole PCB |
| Estado RoHS | — | Compliant |
| Media Compatibility | — | Dry gases (air, non-corrosive) |
| Technology | — | Piezoresistive MEMS with on-chip ASIC |