MPXV5010GP vs MPX5010GSX Comparaison
Comparaison détaillée côte à côte de MPXV5010GP par STMicroelectronics et MPX5010GSX par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
STMicroelectronics
MPXV5010GP - 0-10 kPa Vented Gauge Pressure Sensor, 8-SMD | STMicroelectronics
MPXV5010GP ✓ ActifComparaison des spécifications
| Paramètre | MPXV5010GP | MPX5010GSX |
|---|---|---|
| Marque | STMicroelectronics | NXP Semiconductors |
| Catégorie | Pressure Sensors | Pressure Sensors |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $9,95 | $10,25 |
| Pressure Type | Vented Gauge | Vented Gauge |
| Pressure Range | 0 kPa to 10 kPa (0 PSI to 1.45 PSI) | — |
| Operating Pressure Max | 10 kPa | — |
| Type de sortie | Analog Voltage | Analog Voltage |
| Tension de sortie | 0.2 V to 4.7 V | — |
| Tension d'alimentation | 5 V | — |
| Courant d'alimentation | 5 mA typical | [DATA_NEEDED: supply current typical] |
| Sensitivity | 450 mV/kPa (approx, 0.2-4.7 V span) | — |
| Accuracy | [DATA_NEEDED: accuracy %FS] | 1.0 % typical (per datasheet) |
| Température de fonctionnement | 0 C to +85 C | 0 C to 85 C |
| Port Style | Male - 3.17 mm (0.13 in) Tube, Side Port | — |
| Boîtier | 8-SMD, Gull Wing, Side Port | — |
| Type de montage | Surface Mount | Through Hole |
| Sensor Technology | Piezoresistive (MEMS silicon) | — |
| Signal Conditioning | On-chip, temperature compensated, calibrated | — |
| Output Ratiometric | Yes (output scales with VDD) | — |
| Operating Pressure Range | — | 0 kPa to 10 kPa (0 to 1.45 PSI) |
| Maximum Overload Pressure | — | [DATA_NEEDED: maximum overload pressure] |
| Output Voltage Span | — | 0.2 V to 4.7 V |
| Supply Voltage (VCC) | — | 4.5 V to 5.5 V |
| Response Time | — | [DATA_NEEDED: response time] |
| Port Size | — | Male 0.19 inch (4.93 mm) Tube, Side Port |
| Boîtier / Format | — | 6-SIP Module (Case 867F) |
| Termination Style | — | Through-Hole PCB |
| Statut RoHS | — | Compliant |
| Media Compatibility | — | Dry gases (air, non-corrosive) |
| Technology | — | Piezoresistive MEMS with on-chip ASIC |