MSC8256SVT1000B vs MSC8256ESAG1000B Comparación
Comparación detallada lado a lado de MSC8256SVT1000B por NXP Semiconductors y MSC8256ESAG1000B por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MSC8256SVT1000B - SC3850 6-Core DSP, 1GHz, 783-FCBGA | NXP
MSC8256SVT1000B ObsoleteNXP Semiconductors
MSC8256ESAG1000B - 6x 1GHz SC3850 StarCore DSP | NXP
MSC8256ESAG1000B ⚠ Última compraComparación de especificaciones
| Parámetro | MSC8256SVT1000B | MSC8256ESAG1000B |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | DSP | DSP |
| Estado del ciclo de vida | Obsolete | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $189,00 | $198,75 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | StarCore MSC8256 | — |
| Type | SC3850 Six-Core Digital Signal Processor | — |
| Core Architecture | StarCore SC3850 (VLE, 4-issue) | StarCore SC3850 VLIW DSP |
| Number of Cores | 6 | 6 |
| Core Clock Speed | 1 GHz | — |
| Aggregate Throughput | 1000 MIPS per core (6000 MIPS total) | — |
| Data Width | 32-bit / 64-bit | — |
| L1 Instruction Cache (per core) | 32 KB | — |
| L1 Data Cache (per core) | 32 KB | — |
| Unified L2 Cache (per core) | 512 KB (configurable to M2 memory in 64 KB increments) | — |
| On-Chip RAM (total) | 576 KB | — |
| Non-Volatile Memory (ROM) | 96 KB | — |
| MMU | Yes (hardware memory management unit) | — |
| EPIC (Interrupt Controller) | Yes (Extended Programmable Interrupt Controller) | — |
| Timers (per core) | 2 x 32-bit general-purpose | — |
| DDR Memory Controller | DDR2/DDR3 with ECC | — |
| High-Speed Interfaces | Serial RapidIO, PCI Express, SGMII, RGMII | — |
| Peripheral Interfaces | I2C, SPI, UART, GPIO | — |
| Security Engine | SEC (cryptographic acceleration) | SEC (IPsec/SRTP/SSL) |
| Encapsulado | 783-FCBGA (29x29 mm) | 783-FCPBGA (29x29 mm) |
| Temperatura de funcionamiento | -40C to +105C (industrial) | 0°C to 105°C |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount, BGA |
| Nivel MSL | [DATA_NEEDED: MSL rating] | 3 |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Core Frequency | — | 1 GHz |
| DDR Memory Interface | — | DDR2/DDR3 with ECC |
| Serial RapidIO | — | SRIO (peripheral) |
| PCI Express | — | PCIe (peripheral) |
| Gigabit Ethernet | — | GbE MACs (peripheral) |
| Queue Engine | — | QE (peripheral) |
| Peak Reflow Temperature | — | 245°C (JEDEC J-STD-020) |
| Terminal Finish | — | Tin Silver Copper (e1, JESD-609) |
| TDM Links | — | Up to 4 independent, 62.5 Mbps each |