MSC8256SVT1000B vs MSC8256ESAG1000B Comparaison
Comparaison détaillée côte à côte de MSC8256SVT1000B par NXP Semiconductors et MSC8256ESAG1000B par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MSC8256SVT1000B - SC3850 6-Core DSP, 1GHz, 783-FCBGA | NXP
MSC8256SVT1000B ObsoleteNXP Semiconductors
MSC8256ESAG1000B - 6x 1GHz SC3850 StarCore DSP | NXP
MSC8256ESAG1000B ⚠ Dernier achatComparaison des spécifications
| Paramètre | MSC8256SVT1000B | MSC8256ESAG1000B |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | DSP | DSP |
| Statut du cycle de vie | Obsolete | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $189,00 | $198,75 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | StarCore MSC8256 | — |
| Type | SC3850 Six-Core Digital Signal Processor | — |
| Core Architecture | StarCore SC3850 (VLE, 4-issue) | StarCore SC3850 VLIW DSP |
| Number of Cores | 6 | 6 |
| Core Clock Speed | 1 GHz | — |
| Aggregate Throughput | 1000 MIPS per core (6000 MIPS total) | — |
| Data Width | 32-bit / 64-bit | — |
| L1 Instruction Cache (per core) | 32 KB | — |
| L1 Data Cache (per core) | 32 KB | — |
| Unified L2 Cache (per core) | 512 KB (configurable to M2 memory in 64 KB increments) | — |
| On-Chip RAM (total) | 576 KB | — |
| Non-Volatile Memory (ROM) | 96 KB | — |
| MMU | Yes (hardware memory management unit) | — |
| EPIC (Interrupt Controller) | Yes (Extended Programmable Interrupt Controller) | — |
| Timers (per core) | 2 x 32-bit general-purpose | — |
| DDR Memory Controller | DDR2/DDR3 with ECC | — |
| High-Speed Interfaces | Serial RapidIO, PCI Express, SGMII, RGMII | — |
| Peripheral Interfaces | I2C, SPI, UART, GPIO | — |
| Security Engine | SEC (cryptographic acceleration) | SEC (IPsec/SRTP/SSL) |
| Boîtier | 783-FCBGA (29x29 mm) | 783-FCPBGA (29x29 mm) |
| Température de fonctionnement | -40C to +105C (industrial) | 0°C to 105°C |
| Type de montage | Surface Mount (BGA) | Surface Mount, BGA |
| Niveau MSL | [DATA_NEEDED: MSL rating] | 3 |
| Statut RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Core Frequency | — | 1 GHz |
| DDR Memory Interface | — | DDR2/DDR3 with ECC |
| Serial RapidIO | — | SRIO (peripheral) |
| PCI Express | — | PCIe (peripheral) |
| Gigabit Ethernet | — | GbE MACs (peripheral) |
| Queue Engine | — | QE (peripheral) |
| Peak Reflow Temperature | — | 245°C (JEDEC J-STD-020) |
| Terminal Finish | — | Tin Silver Copper (e1, JESD-609) |
| TDM Links | — | Up to 4 independent, 62.5 Mbps each |