MT40A512M16TB-062E:J vs H5AN8G6NDJR-XNC Comparación
Comparación detallada lado a lado de MT40A512M16TB-062E:J por Micron Technology y H5AN8G6NDJR-XNC por SK hynix. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Micron Technology
MT40A512M16TB-062E:J - 8Gb DDR4 SDRAM 1.6GHz | Micron
MT40A512M16TB-062E:J ✓ Activo
Comparación de especificaciones
| Parámetro | MT40A512M16TB-062E:J | H5AN8G6NDJR-XNC |
|---|---|---|
| Marca | Micron Technology | SK hynix |
| Categoría | Memory ICs | Memory ICs |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $8,10 | $55,68 |
| Tipo de memoria | SDRAM - DDR4 | DDR4 SDRAM |
| Tamaño de memoria | 8Gbit (512M x 16) | 8 Gb |
| Clock Frequency | 1.6 GHz | — |
| Access Time | 19 ns | — |
| Supply Voltage (VDD/VDDQ) | 1.2V ±60mV | — |
| VPP Supply Voltage | 2.5V (-125mV, +250mV) | — |
| I/O Type | 1.2V pseudo open-drain | — |
| Refresh Time | 64ms at -40°C to 85°C; 32ms at >85°C to 95°C; 16ms at >95°C | — |
| Internal Banks (x16) | 8 (2 groups of 4 banks each) | — |
| Prefetch Architecture | 8n-bit | — |
| Encapsulado | 96-FBGA (7.5x13.5 mm) | FBGA-96 (13x7.5 mm) |
| Rango de temperatura de funcionamiento | 0°C to 95°C | — |
| Estado RoHS | Compliant | — |
| Lead-Free | Yes | Yes |
| Tipo de montaje | Surface Mount | — |
| Memory Organization | — | 512M x16 |
| Velocidad de datos | — | 3200 Mbps |
| Supply Voltage (VDD) | — | 1.2 V (max 1.26 V) |
| Number of Terminals | — | 96 |
| Maximum Operating Temperature | — | 85 °C |
| Input/Output Type | — | COMMON |
| RoHS | — | Compliant |
| Sin halógenos | — | Yes |
| Auto Self-Refresh | — | Yes |
| Auto Precharge | — | Yes |
| Data Mask | — | Yes |
| Dynamic On-Chip Termination | — | Yes |
| ZQ Calibration | — | Yes |
| CRC Function | — | Yes |
| Write Leveling | — | Yes |
| Asynchronous Reset | — | Yes |