MTFDKCC7T6TFR-1BC1ZABYY vs MTFDKCC6T4TFS-1BC1ZABYY Comparación
Comparación detallada lado a lado de MTFDKCC7T6TFR-1BC1ZABYY por Micron Technology y MTFDKCC6T4TFS-1BC1ZABYY por Micron Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Micron Technology
MTFDKCC7T6TFR-1BC1ZABYY - 7.68TB U.3 NVMe Data Center SSD | Micron
MTFDKCC7T6TFR-1BC1ZABYY ✓ ActivoMicron Technology
MTFDKCC6T4TFS-1BC1ZABYY - 6.4TB U.3 NVMe Data Center SSD | Micron
MTFDKCC6T4TFS-1BC1ZABYY ✓ ActivoComparación de especificaciones
| Parámetro | MTFDKCC7T6TFR-1BC1ZABYY | MTFDKCC6T4TFS-1BC1ZABYY |
|---|---|---|
| Marca | Micron Technology | Micron Technology |
| Categoría | Memory Modules | Flash |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.099,00 | $1.180,00 |
| Manufacturer | Micron Technology | Micron Technology |
| Series | 7450 PRO | 7450 MAX |
| Capacity | 7.68 TB | 6.4 TB |
| Interfaz | PCIe Gen4 x4 NVMe 1.4 | PCIe Gen 4 x4 NVMe |
| Form Factor | U.3 2.5-inch (SFF-TA-1001, 15mm) | U.3 (15 mm), 70 x 100 mm |
| NAND Type | Micron 176-layer 3D TLC | — |
| Endurance | 1 DWPD (5 years) | — |
| Encryption | Non-SED (AES-256 capable controller) | Non-SED (no hardware encryption) |
| Sequential Read | [DATA_NEEDED: sequential read MB/s] | — |
| Sequential Write | [DATA_NEEDED: sequential write MB/s] | — |
| Random Read IOPS (4K) | [DATA_NEEDED: 4K random read IOPS] | — |
| Random Write IOPS (4K) | [DATA_NEEDED: 4K random write IOPS] | — |
| Temperatura de funcionamiento | 0C to +70C (case) | 0C to +70C (data center) |
| Power Supply | 12V +/- 10% | — |
| Hot-Swap Support | Yes (U.3 hot-swap compliant) | — |
| Power-Loss Protection | Yes | — |
| MTBF | [DATA_NEEDED: MTBF hours] | — |
| Dimensions | 69.85mm x 100.45mm x 15mm | — |
| Weight | [DATA_NEEDED: weight grams] | — |
| Compliance | RoHS, NVMe 1.4, OCP 1.0a | — |
| NAND Technology | — | 176-layer TLC (Triple-Level Cell) |
| Endurance Class | — | Mixed Use (MAX) |
| Use Case | — | Data center mixed read/write workloads |
| Compatible Databases | — | SQL Server, Oracle, MySQL, RocksDB, Cassandra, Aerospike |
| Tipo de montaje | — | Hot-plug 2.5-inch U.3 bay |
| Estado RoHS | — | Compliant |
| Estado del ciclo de vida | — | Active |
| Target Market | — | Enterprise / data center |