MTFDKCC7T6TFR-1BC1ZABYY vs MTFDKCC6T4TFS-1BC1ZABYY Comparaison
Comparaison détaillée côte à côte de MTFDKCC7T6TFR-1BC1ZABYY par Micron Technology et MTFDKCC6T4TFS-1BC1ZABYY par Micron Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Micron Technology
MTFDKCC7T6TFR-1BC1ZABYY - 7.68TB U.3 NVMe Data Center SSD | Micron
MTFDKCC7T6TFR-1BC1ZABYY ✓ ActifMicron Technology
MTFDKCC6T4TFS-1BC1ZABYY - 6.4TB U.3 NVMe Data Center SSD | Micron
MTFDKCC6T4TFS-1BC1ZABYY ✓ ActifComparaison des spécifications
| Paramètre | MTFDKCC7T6TFR-1BC1ZABYY | MTFDKCC6T4TFS-1BC1ZABYY |
|---|---|---|
| Marque | Micron Technology | Micron Technology |
| Catégorie | Memory Modules | Flash |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 099,00 | $1 180,00 |
| Manufacturer | Micron Technology | Micron Technology |
| Series | 7450 PRO | 7450 MAX |
| Capacity | 7.68 TB | 6.4 TB |
| Interface | PCIe Gen4 x4 NVMe 1.4 | PCIe Gen 4 x4 NVMe |
| Form Factor | U.3 2.5-inch (SFF-TA-1001, 15mm) | U.3 (15 mm), 70 x 100 mm |
| NAND Type | Micron 176-layer 3D TLC | — |
| Endurance | 1 DWPD (5 years) | — |
| Encryption | Non-SED (AES-256 capable controller) | Non-SED (no hardware encryption) |
| Sequential Read | [DATA_NEEDED: sequential read MB/s] | — |
| Sequential Write | [DATA_NEEDED: sequential write MB/s] | — |
| Random Read IOPS (4K) | [DATA_NEEDED: 4K random read IOPS] | — |
| Random Write IOPS (4K) | [DATA_NEEDED: 4K random write IOPS] | — |
| Température de fonctionnement | 0C to +70C (case) | 0C to +70C (data center) |
| Power Supply | 12V +/- 10% | — |
| Hot-Swap Support | Yes (U.3 hot-swap compliant) | — |
| Power-Loss Protection | Yes | — |
| MTBF | [DATA_NEEDED: MTBF hours] | — |
| Dimensions | 69.85mm x 100.45mm x 15mm | — |
| Weight | [DATA_NEEDED: weight grams] | — |
| Compliance | RoHS, NVMe 1.4, OCP 1.0a | — |
| NAND Technology | — | 176-layer TLC (Triple-Level Cell) |
| Endurance Class | — | Mixed Use (MAX) |
| Use Case | — | Data center mixed read/write workloads |
| Compatible Databases | — | SQL Server, Oracle, MySQL, RocksDB, Cassandra, Aerospike |
| Type de montage | — | Hot-plug 2.5-inch U.3 bay |
| Statut RoHS | — | Compliant |
| Statut du cycle de vie | — | Active |
| Target Market | — | Enterprise / data center |