OSD3358-512M-ISM vs OSD3358-512M-BAS-XB Comparación
Comparación detallada lado a lado de OSD3358-512M-ISM por Octavo Systems y OSD3358-512M-BAS-XB por Octavo Systems. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Octavo Systems
OSD3358-512M-ISM - 1GHz Cortex-A8 SiP SOM, 512MB DDR3 | Octavo Systems
OSD3358-512M-ISM ✓ ActivoOctavo Systems
OSD3358-512M-BAS-XB - SiP ARM Cortex-A8 1GHz | Octavo Systems
OSD3358-512M-BAS-XB ✓ ActivoComparación de especificaciones
| Parámetro | OSD3358-512M-ISM | OSD3358-512M-BAS-XB |
|---|---|---|
| Marca | Octavo Systems | Octavo Systems |
| Categoría | Wireless Modules | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $46,80 | $67,20 |
| Product Type | System-in-Package (SiP) / System-on-Module (SOM) | — |
| Series | OSD3358 | — |
| Core Processor | Texas Instruments AM3358 ARM Cortex-A8 NEON SIMD | — |
| CPU Speed | 1 GHz | — |
| RAM Size | 512 MB DDR3 | — |
| PMIC | TPS65217C | — |
| Auxiliary LDO | TL5209 | — |
| EEPROM | 4 KB | — |
| Encapsulado | 256-ball BGA, 21 mm x 21 mm | 400-ball BGA |
| Form Factor | SiP (System-in-Package) | — |
| Ball Pitch | [DATA_NEEDED: ball pitch] | — |
| Temperatura de funcionamiento | -40C to +85C (industrial) | — |
| Tensión de alimentación | [DATA_NEEDED: main rail voltage] | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Nivel MSL | [DATA_NEEDED: MSL rating] | — |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Tray Quantity | [DATA_NEEDED: tray qty] | — |
| Device Type | — | System-In-Package (SiP) |
| Integrated Processor | — | TI Sitara AM3358 ARM Cortex-A8 |
| Maximum CPU Clock | — | 1 GHz |
| Graphics Accelerator | — | SGX530 |
| Onboard DDR3 SDRAM | — | 512 MB |
| Power Management IC | — | TPS65217C (integrated) |
| Rango de temperatura de funcionamiento | — | -40 C to +85 C (industrial) |
| PRU-ICSS Subsystems | — | 2 (industrial-grade) |
| Ethernet | — | 10/100/1000 Mbps (Gigabit) |
| USB | — | USB 2.0 High-Speed PHY |
| CAN | — | 2x CAN 2.0B |
| SPI | — | 2x SPI |
| I2C | — | 3x I2C |