OSD3358-512M-ISM vs OSD3358-512M-BAS-XB 对比
详细并排对比 OSD3358-512M-ISM 出自 Octavo Systems 和 OSD3358-512M-BAS-XB 出自 Octavo Systems。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Octavo Systems
OSD3358-512M-ISM - 1GHz Cortex-A8 SiP SOM, 512MB DDR3 | Octavo Systems
OSD3358-512M-ISM ✓ 量产中Octavo Systems
OSD3358-512M-BAS-XB - SiP ARM Cortex-A8 1GHz | Octavo Systems
OSD3358-512M-BAS-XB ✓ 量产中规格对比
| 参数 | OSD3358-512M-ISM | OSD3358-512M-BAS-XB |
|---|---|---|
| 品牌 | Octavo Systems | Octavo Systems |
| 分类 | Wireless Modules | Microcontrollers |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $46.80 | $67.20 |
| Product Type | System-in-Package (SiP) / System-on-Module (SOM) | — |
| Series | OSD3358 | — |
| Core Processor | Texas Instruments AM3358 ARM Cortex-A8 NEON SIMD | — |
| CPU Speed | 1 GHz | — |
| RAM Size | 512 MB DDR3 | — |
| PMIC | TPS65217C | — |
| Auxiliary LDO | TL5209 | — |
| EEPROM | 4 KB | — |
| 封装 | 256-ball BGA, 21 mm x 21 mm | 400-ball BGA |
| Form Factor | SiP (System-in-Package) | — |
| Ball Pitch | [DATA_NEEDED: ball pitch] | — |
| 工作温度 | -40C to +85C (industrial) | — |
| 电源电压 | [DATA_NEEDED: main rail voltage] | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| MSL 等级 | [DATA_NEEDED: MSL rating] | — |
| RoHS 状态 | Compliant | Compliant |
| Lead-Free | Yes | — |
| Tray Quantity | [DATA_NEEDED: tray qty] | — |
| Device Type | — | System-In-Package (SiP) |
| Integrated Processor | — | TI Sitara AM3358 ARM Cortex-A8 |
| Maximum CPU Clock | — | 1 GHz |
| Graphics Accelerator | — | SGX530 |
| Onboard DDR3 SDRAM | — | 512 MB |
| Power Management IC | — | TPS65217C (integrated) |
| 工作温度范围 | — | -40 C to +85 C (industrial) |
| PRU-ICSS Subsystems | — | 2 (industrial-grade) |
| Ethernet | — | 10/100/1000 Mbps (Gigabit) |
| USB | — | USB 2.0 High-Speed PHY |
| CAN | — | 2x CAN 2.0B |
| SPI | — | 2x SPI |
| I2C | — | 3x I2C |