P1021NSE2HFB vs P1012NSE2HFB Comparación
Comparación detallada lado a lado de P1021NSE2HFB por NXP Semiconductors y P1012NSE2HFB por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | P1021NSE2HFB | P1012NSE2HFB |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $98,75 | $52,75 |
| Processor Family | QorIQ P1 | — |
| Processor Core | Power Architecture e500v2 (dual-core) | PowerPC e500v2 |
| CPU Frequency | 800 MHz per core | — |
| Core Count | 2 | — |
| Ancho del bus de datos | 32-bit | — |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| Ethernet | 3x Gigabit Ethernet (eTSEC) | Integrated GbE (multiple MACs) |
| Security Engine | SEC 4.x (IPsec/SSL offload) | — |
| QUICC Engine | Yes (TDM/HDLC/UART) | — |
| PCIe | PCIe Gen1 | — |
| USB | USB 2.0 | USB 2.0 (host + device) |
| TDM/HDLC | Yes (via QUICC Engine) | — |
| Temperatura de funcionamiento | 0C to +125C | — |
| Encapsulado | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) with exposed thermal pad |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Revision | R1.1 | — |
| Lead Free | Yes | — |
| RoHS | Compliant | — |
| Processor Series | — | QorIQ P1 |
| Number of Cores | — | 1 |
| Core Architecture | — | 32-Bit Power Architecture |
| Maximum Core Frequency | — | 800 MHz |
| Process Technology | — | 45 nm CMOS |
| PCIe Controllers | — | PCIe Gen 2 (x1/x2/x4) |
| TDM Interfaces | — | 4 (T1/E1) |
| QUICC Engine (QE) | — | Yes (protocol offload) |
| SEC Security Accelerator | — | SEC 4.0 |
| Operating Temperature (Tj) | — | 0C to +125C |
| Estado RoHS | — | RoHS Compliant |
| Lead Free Status | — | Lead Free |
| Packaging | — | Tray |