P2010NSE2KHC vs P1011NSE2FFB Comparación
Comparación detallada lado a lado de P2010NSE2KHC por NXP Semiconductors y P1011NSE2FFB por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
P2010NSE2KHC - QorIQ P2010 e500v2 MPU 1.2GHz 689-TEBGA II | NXP
P2010NSE2KHC ⚠ Última compraNXP Semiconductors
P1011NSE2FFB - QorIQ P1 800MHz e500v2 SoC, 1-Core | NXP
P1011NSE2FFB ✗ Fin de vidaComparación de especificaciones
| Parámetro | P2010NSE2KHC | P1011NSE2FFB |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Última compra | Fin de vida |
| Core Processor | PowerPC e500v2 | — |
| Number of Cores | 1 | 1 |
| Core Architecture | 32-Bit Power Architecture | PowerPC e500v2 |
| Maximum Core Frequency | 1.2 GHz | — |
| Co-Processors / DSP | Security; SEC 3.3 | — |
| RAM Controller | DDR2, DDR3 with ECC | — |
| Ethernet | 10/100/1000 Mbps (GbE) | — |
| PCIe | PCI Express Gen 1 | — |
| Serial RapidIO | Yes | — |
| USB | USB 2.0 | USB 2.0 High-Speed with ULPI |
| Process Technology | 45 nm | 45 nm |
| Rango de temperatura de funcionamiento | 0 C to 125 C (junction) | — |
| Encapsulado | 689-TEBGA II (31x31 mm) with exposed thermal pad | 689-TEPBGA II (31x31 mm) |
| Tipo de montaje | Surface Mount | — |
| Nivel MSL | [DATA_NEEDED: MSL level] | 3 |
| Estado RoHS | RoHS Compliant | RoHS Compliant (Lead Free) |
| Lead-Free Status | Lead Free | — |
| Silicon Revision | Rev 2.1 | — |
| Series | QorIQ P2 | — |
| Graphics Acceleration | No | — |
| Core Frequency (Max) | — | 800 MHz |
| Bit Width | — | 32-bit |
| L1 Cache (per core) | — | 32 KB I-cache + 32 KB D-cache |
| L2 Cache | — | 256 KB with ECC |
| Ethernet MACs | — | 3 × 10/100/1000 Mbps |
| Memory Controller | — | DDR2/DDR3 with ECC, up to 800 MT/s |
| PCIe Controllers | — | 2 × PCIe Gen 1 (x4/x2 or x4+x1) |
| TDM/HDLC Channels | — | 4 |
| Security Engine | — | SEC 2.0 (crypto accelerator) |
| Local Bus | — | 32-bit |
| Temperatura de funcionamiento | — | 0°C to +125°C |
| Typical Power Dissipation | — | [DATA_NEEDED: TDP figure] |