RTAX2000S-1LG1152V vs RTAX2000S-LG1152V Comparación
Comparación detallada lado a lado de RTAX2000S-1LG1152V por Microchip Technology y RTAX2000S-LG1152V por Microsemi. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
RTAX2000S-1LG1152V - 2M-Gate Rad-Tolerant FPGA | Microchip
RTAX2000S-1LG1152V ✓ ActivoMicrosemi
RTAX2000S-LG1152V - 2M-Gate Rad-Tolerant FPGA | Actel/Microchip
RTAX2000S-LG1152V ✓ ActivoComparación de especificaciones
| Parámetro | RTAX2000S-1LG1152V | RTAX2000S-LG1152V |
|---|---|---|
| Marca | Microchip Technology | Microsemi |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $9.750,00 |
| Equivalent System Gates | 2,000,000 gates | 2000000 |
| Logic Cells | 32,256 | 32256 |
| CLBs (Logic Elements) | 21,504 | — |
| Technology | CMOS antifuse (OTP) | Digital CMOS, antifuse (one-time programmable) |
| Family | RTAX-S/SL Radiation-Tolerant FPGAs | RTAX-S/SL and RTAX-DSP Radiation-Tolerant FPGAs |
| Speed Grade | -1 | — |
| Encapsulado | 1152-ball ceramic column grid array (LG1152 / CGA-1152) | LG1152 (1152-pin ceramic column grid array) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Configuration | Live at power-up (antifuse, no external boot device) | — |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic | Embedded SRAM with built-in FIFO control logic |
| Clock Features | Segmentable clocks, chip-wide synchronization | — |
| Radiation Tolerance | Radiation-tolerant for space flight systems | Radiation-tolerant for space-flight systems |
| Programmability | One-time programmable (OTP) | — |
| Power | [DATA_NEEDED: static and dynamic power figures] | — |
| Core Voltage | [DATA_NEEDED: core supply voltage] | — |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: Operating Temperature] |
| Qualification | Space/defense qualified flow (see Microchip DLA Cross Reference Guide) | — |
| Estado RoHS | unknown (ceramic hermetic package; verify on product page) | — |
| CLBs | — | 21504 |
| Base Architecture | — | Microsemi commercial Axcelerator family |
| Clocking | — | Segmentable clocks |
| Routing | — | Chip-wide highway routing and carry logic |
| Power-Up Behavior | — | Live at power-up (no external configuration device) |
| Core Supply Voltage | — | [DATA_NEEDED: Core Supply Voltage] |
| Max User I/O | — | [DATA_NEEDED: Max User I/O count] |
| Nivel MSL | — | [DATA_NEEDED: MSL Level] |