RTAX2000S-1LG1152V - 2M-Gate Rad-Tolerant FPGA | Microchip
N.º de pieza: RTAX2000S-1LG1152V ✓ Activo| Cant. | Precio unitario | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
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RTAX2000S-1LG1152V Descripción general
A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the heavy-ion and proton environments of space flight. Within the semiconductor hierarchy, the RTAX2000S sits under FPGA -> programmable logic device -> digital CMOS IC. Unlike SRAM-based FPGAs, RTAX-S devices use antifuse programmability, which is inherently one-time programmable (OTP) and immune to configuration upsets, delivering true single-chip form factor and live-at-power-up operation without external boot configuration devices.
Key features include 2 million system gates for complex onboard processing, embedded SRAM blocks with built-in FIFO control logic, segmentable clock circuitry, and chip-wide synchronization, all derived from the commercial Axcelerator architecture. The device belongs to the RTAX-S/SL and RTAX-DSP family, which reaches densities of up to four million equivalent gates for space-based payloads. Low static power consumption and single-chip integration reduce mass, board area, and radiation-sensitive component count.
The antifuse fabric combines high performance with configuration upset immunity, while qualification against defense and space quality flows (QML Class V heritage per the Microchip DLA cross-reference documentation) supports mission-critical flight programs. Typical applications include satellite payload processing, telemetry and command systems, spacecraft bus controllers, and radiation-hardened signal processing chains, where deterministic live-at-power-up behavior and single-chip redundancy savings are decisive.
When designing with this device, plan the one-time programming flow carefully: use the RTAX2000S-1LG1152PROTO prototyping device to validate designs before committing flight units, since antifuse programming is irreversible.
This page synthesizes verified distributor data, family drop-in options, and practical design guidance not found in the manufacturer datasheet.
Alternativas directas para RTAX2000S-1LG1152V — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con RTAX2000S-1LG1152V (mismo factor de forma y huella) — difiere en Package, Radiation Tolerance, Equivalent System Gates, Family, Configuration.
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RTAX2000S-CG1152V
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RTAX2000S-1CG1152V
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Ver hoja de datos →RTAX2000S-1LG1152V Valores máximos y características eléctricas
| Equivalent System Gates | 2,000,000 gates |
| Logic Cells | 32,256 |
| CLBs (Logic Elements) | 21,504 |
| Technology | CMOS antifuse (OTP) |
| Family | RTAX-S/SL Radiation-Tolerant FPGAs |
| Speed Grade | -1 |
| Encapsulado | 1152-ball ceramic column grid array (LG1152 / CGA-1152) |
| Tipo de montaje | Surface Mount |
| Configuration | Live at power-up (antifuse, no external boot device) |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Clock Features | Segmentable clocks, chip-wide synchronization |
| Radiation Tolerance | Radiation-tolerant for space flight systems |
| Programmability | One-time programmable (OTP) |
| Qualification | Space/defense qualified flow (see Microchip DLA Cross Reference Guide) |
| Estado RoHS | unknown (ceramic hermetic package; verify on product page) |
Guía de configuración de pines de RTAX2000S-1LG1152V 1152-ball ceramic column grid array (lg1152 / cga-1152)
Configuración de pines para RTAX2000S-1LG1152V (encapsulado 1152-ball ceramic column grid array (lg1152 / cga-1152)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para RTAX2000S-1LG1152V.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
RTAX2000S-1LG1152V es adecuado para 6 aplicacións: Satellite Payload Processing, Spacecraft Bus Control, Telemetry and Command Systems, Radiation-Hardened Signal Processing, Instrumentation and Sensor Interface Glue Logic, Launch Vehicle and Avionics Electronics.
Satellite Payload Processing
The RTAX2000S-1LG1152V fits satellite payload processing where 2,000,000 equivalent gates and 32,256 logic cells handle onboard image or telemetry preprocessing. Its antifuse fabric is immune to configuration upsets, eliminating external configuration memory and scrubbing logic - a key reliability benefit in orbit. The embedded SRAM with built-in FIFO control supports high-throughput data buffering between payload sensors and downlink chains. Because the device is live at power-up, payload logic is operational immediately after switch-on without boot delay. Designers typically prototype on the RTAX2000S-1LG1152PROTO before committing flight units, since antifuse programming is one-time and irreversible.
Recomendado
Spacecraft Bus Control
Spacecraft bus controllers benefit from the RTAX2000S-1LG1152V's deterministic live-at-power-up behavior and single-chip integration. Command handling, mode control, and interface bridging fit comfortably within 21,504 CLBs, while segmentable clocks allow independent clock domains for telemetry and command subsystems. The true single-chip form factor removes configuration devices that would otherwise add mass and failure modes to the bus avionics. Low-power consumption of the antifuse fabric reduces the load on limited spacecraft power budgets, and the 1152-ball ceramic package provides robust mechanical connections tolerant of launch vibration environments.
Recomendado
Telemetry and Command Systems
Telemetry and command chains demand logic that is instantly operational and configuration-error free, which the RTAX2000S-1LG1152V delivers through its antifuse architecture. Its 32,256 logic cells implement CCSDS-style framing, encoding, and interface glue logic with headroom for redundancy voting schemes. The -1 speed grade offers ample timing margin for typical TM/TC data rates, and chip-wide synchronization features aid deterministic startup sequencing across redundant channels. Since the fabric cannot be configuration-upset by heavy ions, command path integrity is maintained throughout the mission without scrubbing overhead.
Recomendado
Radiation-Hardened Signal Processing
The RTAX2000S-1LG1152V supports onboard DSP chains through the RTAX-DSP family features, including embedded SRAM blocks with FIFO control suited to FIR filtering, FFT staging, and data path buffering. With 2,000,000 equivalent gates, moderate-width fixed-point datapaths and control logic are implemented in a single rad-tolerant device, replacing multiple discrete SSI/MSI parts and cutting board area and assembly count. The antifuse configuration is upset-immune, so datapath control logic remains intact under heavy-ion flux, while SEU mitigation techniques can be applied at the RTL level for state registers.
Recomendado
Instrumentation and Sensor Interface Glue Logic
Space science instruments use the RTAX2000S-1LG1152V as sensor interface and glue logic: ADC framing, detector timing generation, and housekeeping aggregation all fit within the 21,504 CLB fabric. The ceramic CGA-1152 package provides high I/O counts required by multi-channel detector arrays, and the antifuse design ensures the interface logic is functional from the moment instrument power is applied, simplifying autonomous operations. Segmentable clocks let designers generate precise detector timing domains independent of the main bus clock, improving measurement timing fidelity.
Recomendado
Launch Vehicle and Avionics Electronics
Launch vehicle avionics adopt the RTAX2000S-1LG1152V where single-event immunity and immediate power-up are mandatory for flight-critical sequencing. The 2M-gate capacity accommodates redundant-voting flight control logic, motor interface bridging, and telemetry formatting on one chip, while the hermetic 1152-ball ceramic package withstands launch mechanical environments. Because configuration is permanent in antifuse silicon, there is no risk of a boot failure during ascent, and the QML Class V heritage supported by the Microchip DLA cross-reference documentation simplifies program qualification evidence.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para RTAX2000S-1LG1152V — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | RTAX2000S-CG1152V | RTAX2000S-1LG1152PROTO | RTAX2000S-1CG1152V |
|---|---|---|---|---|
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 1152-ball ceramic CGA (LG1152) | 1152-ball ceramic CGA - same | 1152-ball ceramic CGA - same | 1152-ball ceramic CGA - same |
| Equivalent System Gates | 2,000,000 | 2,000,000 | 2,000,000 | 2,000,000 |
| Logic Cells | 32,256 | 32,256 | 32,256 | 32,256 |
| CLBs | 21,504 | 21,504 | 21,504 | 21,504 |
| Speed Grade | -1 | per CG suffix ordering code | -1 | -1 |
| Configuration Type | Antifuse OTP, live at power-up | Antifuse OTP, live at power-up | Antifuse OTP, live at power-up | Antifuse OTP, live at power-up |
| Intended Use | Flight unit | Flight unit (alternate flow) | Prototyping / design validation | Flight unit (alternate flow) |
Diferenciadores clave
- Live-at-power-up antifuse configuration (frente a RTAX2000S-CG1152V)
- Prototype-then-fly workflow support (frente a RTAX2000S-1LG1152PROTO)
- 2M-gate density with 1152-ball I/O capacity (frente a RTAX250S-CG624V)
Notas de diseño
Antifuse FPGAs are one-time programmable: a design error on a flight unit cannot be reworked by reprogramming. Always complete timing closure and functional validation on the RTAX2000S-1LG1152PROTO prototyping device before programming flight RTAX2000S-1LG1152V units, and freeze the bitstream under configuration control. Order flight units only after design sign-off, since flight screening makes each unit costly and lead times long.
The 1152-ball ceramic column grid array requires careful PCB stackup planning: design the land pattern for column-grid (CGA) solder columns, not standard BGA balls, and provide adequate thermal relief through the board. Verify escape routing density against layer count before layout, and follow the manufacturer's CGA assembly and rework guidance - column inspection via X-ray is standard practice for space hardware.
RTAX-S antifuse devices draw low static power relative to SRAM FPGAs because there is no configuration bitstream memory to refresh, and no external configuration flash is required. Budget supply rails per the RTAX-S datasheet power estimator tool rather than generic FPGA figures, and verify total ionizing dose and latch-up performance against your mission environment profile in the official datasheet.
Información de cumplimiento
Flight-grade ceramic hermetic package; qualification follows space/defense flows (QML Class V heritage referenced in Microchip DLA Cross Reference Guide) rather than commercial RoHS/AEC-Q100 marking. Verify environmental compliance with the manufacturer for the specific lot.