RTAX4000SL-CQ352PROTO vs RTAX4000SL-CQ352EV Comparación
Comparación detallada lado a lado de RTAX4000SL-CQ352PROTO por Microchip Technology y RTAX4000SL-CQ352EV por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
RTAX4000SL-CQ352PROTO - 4M-Gate Radiation-Tolerant FPGA | Microchip
RTAX4000SL-CQ352PROTO ✓ ActivoMicrochip Technology
RTAX4000SL-CQ352EV - 4M Gate Rad-Tolerant FPGA | Microchip
RTAX4000SL-CQ352EV ✓ ActivoComparación de especificaciones
| Parámetro | RTAX4000SL-CQ352PROTO | RTAX4000SL-CQ352EV |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | RF Modules | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $10.250,00 |
| Family | RTAX-S/SL Radiation-Tolerant FPGAs | RTAX-SL (Radiation-Tolerant FPGA) |
| Equivalent System Gates | 4,000,000 | — |
| Logic Cells | 60,480 | — |
| CLBs | 40,320 | — |
| CLB Combinatorial Delay (Max) | 1.1 ns | — |
| Technology | CMOS, antifuse (one-time programmable) | — |
| Encapsulado | CQFP-352, ceramic metal-sealed cofired | 352-pin CQFP (Ceramic Quad Flat Pack) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | -55C to +125C | [DATA_NEEDED: operating temperature range] |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic | — |
| Clock Architecture | Segmentable clocks, chip-wide highway routing | — |
| Arithmetic Support | Dedicated carry logic | — |
| Configuration | Live-at-power-up, no external configuration device | Single-chip, no external boot memory |
| Target Market | Space-flight systems | — |
| Tensión de alimentación | [DATA_NEEDED: core supply voltage] | — |
| User I/O Count (CQ352) | [DATA_NEEDED: user I/O count] | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| System Gates | — | 4,000,000 |
| Logic Cells (ASIC Gates) | — | 40,320 |
| Process Technology | — | 0.15 um CMOS antifuse |
| Core Supply Voltage | — | 1.5 V |
| Screening Level | — | EV (enhanced spaceflight screening) |
| Programming Technology | — | Antifuse (one-time programmable, live at power-up) |
| Radiation Tolerance | — | Radiation-tolerant (TID/SEL/SEU per family datasheet) |
| I/O Supply Voltage | — | [DATA_NEEDED: I/O bank voltage] |
| Maximum System Frequency | — | [DATA_NEEDED: maximum system frequency] |
| Package Material | — | Hermetic ceramic (JESD-30 S-CQFP-F352) |
| Typical Application | — | Space-flight systems, satellites, payload processing |