S912XDP512J1CAG vs MC9S12XDT512MAA Comparación
Comparación detallada lado a lado de S912XDP512J1CAG por NXP Semiconductors y MC9S12XDT512MAA por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
S912XDP512J1CAG - 16-bit S12X MCU, 512KB Flash, 80MHz, 144-LQFP
S912XDP512J1CAG ⚠ Última compra
Comparación de especificaciones
| Parámetro | S912XDP512J1CAG | MC9S12XDT512MAA |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Última compra | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $14,85 | $0,00 |
| Core Architecture | HCS12X (S12XD family) | — |
| Ancho del bus de datos | 16-bit | — |
| Program Memory (Flash) | 512 KB (512K x 8) | — |
| RAM Size | 32 KB | 20KB |
| EEPROM Size | 4 KB | 4KB |
| CPU Clock Frequency (Max) | 80 MHz | — |
| Tensión de alimentación de funcionamiento | 2.5 V | — |
| Rango de temperatura de funcionamiento | -40C to +85C | — |
| Encapsulado | 144-LQFP (20x20 mm, 0.5 mm pitch) | 80-QFP (14x14 mm), Square, Gull Wing |
| Tipo de montaje | Surface Mount | Surface Mount |
| CAN Controllers | 2 (CAN 2.0 A/B) | — |
| SCI / UART | Multiple | — |
| SPI / IIC | Yes | — |
| ADC | 8-channel, 10/12-bit | — |
| PWM Channels | Up to 8 | — |
| Automotive Qualified | Yes (per NXP product page) | — |
| Estado RoHS | Compliant | — |
| Core Processor | — | HCS12X |
| Core Size | — | 16-Bit |
| Maximum Clock Speed | — | 80 MHz |
| Program Memory Size | — | 512KB (512K x 8) |
| Program Memory Type | — | FLASH |
| Connectivity | — | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Number of I/O | — | 59 |
| ADC Resolution | — | 10-bit, 8-channel |
| Tensión de alimentación | — | [DATA_NEEDED: supply voltage range] |
| Temperatura de funcionamiento | — | -40C to +125C (TA) |
| Packaging Method | — | Tray |
| Sin halógenos | — | Compliant |
| ECCN | — | 3A991.a.2 |
| Estimated EOL Date | — | 2028 |