S912XEQ512F0CAL vs MC9S12XDT512MAA Comparación
Comparación detallada lado a lado de S912XEQ512F0CAL por NXP Semiconductors y MC9S12XDT512MAA por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
S912XEQ512F0CAL - 16-bit 50MHz 512KB Flash MCU | NXP Automotive
S912XEQ512F0CAL ✓ Activo
Comparación de especificaciones
| Parámetro | S912XEQ512F0CAL | MC9S12XDT512MAA |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $7,44 | $0,00 |
| Core Processor | HCS12X (S12X core with XGATE co-processor) | HCS12X |
| Core Size | 16-Bit | 16-Bit |
| Bus Speed | 50 MHz | — |
| Program Flash Memory | 512 KB (512K x 8) | — |
| EEPROM | Hardware-emulated, flexible programmable | — |
| RAM | [DATA_NEEDED: RAM size] | — |
| ADC Resolution | 12-bit | 10-bit, 8-channel |
| ADC Conversion Time | 3 us | — |
| Timers | Enhanced Capture Timer (ECT), Periodic Interrupt Timer (PIT), Real Time Interrupt (RTI) | — |
| Memory Protection | MPU with supervisor/user modes | — |
| Tensión de alimentación | 1.8 V / 2.8 V / 5 V | [DATA_NEEDED: supply voltage range] |
| Temperatura de funcionamiento | -40C to +85C | -40C to +125C (TA) |
| Encapsulado | 112-LQFP (20 x 20 mm), gull-wing terminals, square body | 80-QFP (14x14 mm), Square, Gull Wing |
| Tipo de montaje | Surface Mount | Surface Mount |
| Qualification | Automotive Qualified, AEC-Q100 | — |
| Packaging | Tray | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | — |
| Peripherals | DMA (XGATE), LVD, POR, PWM | LVD, POR, PWM, WDT |
| Maximum Clock Speed | — | 80 MHz |
| Program Memory Size | — | 512KB (512K x 8) |
| Program Memory Type | — | FLASH |
| RAM Size | — | 20KB |
| EEPROM Size | — | 4KB |
| Connectivity | — | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI |
| Number of I/O | — | 59 |
| Packaging Method | — | Tray |
| Sin halógenos | — | Compliant |
| ECCN | — | 3A991.a.2 |
| Estimated EOL Date | — | 2028 |