S912XEQ512F0CAL vs MC9S12XDT512MAA Comparaison
Comparaison détaillée côte à côte de S912XEQ512F0CAL par NXP Semiconductors et MC9S12XDT512MAA par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
S912XEQ512F0CAL - 16-bit 50MHz 512KB Flash MCU | NXP Automotive
S912XEQ512F0CAL ✓ Actif
Comparaison des spécifications
| Paramètre | S912XEQ512F0CAL | MC9S12XDT512MAA |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $7,44 | $0,00 |
| Core Processor | HCS12X (S12X core with XGATE co-processor) | HCS12X |
| Core Size | 16-Bit | 16-Bit |
| Bus Speed | 50 MHz | — |
| Program Flash Memory | 512 KB (512K x 8) | — |
| EEPROM | Hardware-emulated, flexible programmable | — |
| RAM | [DATA_NEEDED: RAM size] | — |
| ADC Resolution | 12-bit | 10-bit, 8-channel |
| ADC Conversion Time | 3 us | — |
| Timers | Enhanced Capture Timer (ECT), Periodic Interrupt Timer (PIT), Real Time Interrupt (RTI) | — |
| Memory Protection | MPU with supervisor/user modes | — |
| Tension d'alimentation | 1.8 V / 2.8 V / 5 V | [DATA_NEEDED: supply voltage range] |
| Température de fonctionnement | -40C to +85C | -40C to +125C (TA) |
| Boîtier | 112-LQFP (20 x 20 mm), gull-wing terminals, square body | 80-QFP (14x14 mm), Square, Gull Wing |
| Type de montage | Surface Mount | Surface Mount |
| Qualification | Automotive Qualified, AEC-Q100 | — |
| Packaging | Tray | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | — |
| Peripherals | DMA (XGATE), LVD, POR, PWM | LVD, POR, PWM, WDT |
| Maximum Clock Speed | — | 80 MHz |
| Program Memory Size | — | 512KB (512K x 8) |
| Program Memory Type | — | FLASH |
| RAM Size | — | 20KB |
| EEPROM Size | — | 4KB |
| Connectivity | — | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI |
| Number of I/O | — | 59 |
| Packaging Method | — | Tray |
| Sans halogène | — | Compliant |
| ECCN | — | 3A991.a.2 |
| Estimated EOL Date | — | 2028 |