S9S08QD4J1VSC vs MC9S08QD4MSC Comparación
Comparación detallada lado a lado de S9S08QD4J1VSC por NXP Semiconductors y MC9S08QD4MSC por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | S9S08QD4J1VSC | MC9S08QD4MSC |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | Fin de vida |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1,31 | $1,18 |
| Core Architecture | HCS08 (S08 family) | CISC, enhanced HCS08 |
| CPU Bit Width | 8-bit | — |
| Maximum CPU Frequency | 16 MHz | 16 MHz |
| Program Memory (Flash) | 4 KB (4K x 8) | — |
| RAM | 256 B | 256 B (0.256 KB) |
| Supply Voltage (VDD) | 2.7 V to 5.5 V | — |
| Temperatura de funcionamiento | -40C to +105C | [DATA_NEEDED: operating temperature range] |
| Encapsulado | 8-pin SOIC (SOIC-8) | 8-SOIC |
| Tipo de montaje | Surface Mount | Surface Mount |
| ADC | 8-channel 10-bit | 4-channel, 10-bit |
| Timers | TPM (16-bit) + MTIM (8-bit) | — |
| Debug Interface | Background debug (single wire) + on-chip breakpoints | Single-wire background debug (BDM active in STOP when ENBDM set) |
| AEC-Q100 | Qualified (automotive) | — |
| Instruction Set | HC08 + BGND | — |
| Nivel MSL | MSL3 (per SOIC-8 standard) | — |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Core | — | S08 (HCS08), 8-bit |
| Flash Memory | — | 4 KB (4K x 8) |
| Number of I/Os | — | 6 |
| Tensión de alimentación | — | [DATA_NEEDED: supply voltage range] |
| Series | — | S08QD (9S08QD4 series) |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |
| Estado del ciclo de vida | — | End of Life (per NXP product page) |