S9S08QD4J2MSC vs MC9S08QD4CSC Comparación
Comparación detallada lado a lado de S9S08QD4J2MSC por NXP Semiconductors y MC9S08QD4CSC por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
S9S08QD4J2MSC - 8-bit S08 MCU, 4KB Flash, 16MHz, Automotive | NXP
S9S08QD4J2MSC ✓ ActivoComparación de especificaciones
| Parámetro | S9S08QD4J2MSC | MC9S08QD4CSC |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Fin de vida |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1,14 | $0,00 |
| Manufacturer | NXP Semiconductors | — |
| Core Architecture | HCS08 (8-bit, HC08-compatible with BGND) | — |
| CPU Frequency | 16 MHz | — |
| Program Memory (Flash) | 4 KB (4K x 8) | — |
| RAM | 256 bytes | 256 B |
| Encapsulado | 8-SOIC (0.154", 3.90 mm width) | 8-SOIC |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | -40C to +125C (automotive grade) | [DATA_NEEDED: operating temperature range] |
| AEC-Q100 Qualification | Qualified | — |
| Número de pines | 8 | — |
| General-Purpose I/O Pins | 4 (plus 1 input-only and 1 output-only pin) | — |
| Tensión de alimentación | [DATA_NEEDED: VDD range] | 3.3 V / 5 V |
| ADC | On-chip ADC (channel count per datasheet) | — |
| Timers | On-chip timer(s) | — |
| Communication | SCI/SPI (per datasheet) | — |
| Debug Interface | Background Debug Mode (BDM) with breakpoints | Background debugging system (single-wire BDM) |
| Low-Power Modes | STOP and WAIT | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | — |
| Core Processor | — | S08 (HCS08), 8-bit CISC |
| Core Size | — | 8-bit |
| Frecuencia de reloj máxima | — | 16 MHz |
| Flash Memory | — | 4 KB (4K x 8) |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 4 |
| General-Purpose I/O | — | 6 |
| Instruction Set | — | HC08 with added BGND instruction |
| Packaging | — | Tube |
| Life Cycle Stage | — | End of Life (per NXP product page) |