S9S08QD4J2MSC vs MC9S08QD4CSC Comparaison
Comparaison détaillée côte à côte de S9S08QD4J2MSC par NXP Semiconductors et MC9S08QD4CSC par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
S9S08QD4J2MSC - 8-bit S08 MCU, 4KB Flash, 16MHz, Automotive | NXP
S9S08QD4J2MSC ✓ ActifComparaison des spécifications
| Paramètre | S9S08QD4J2MSC | MC9S08QD4CSC |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | Fin de vie |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1,14 | $0,00 |
| Manufacturer | NXP Semiconductors | — |
| Core Architecture | HCS08 (8-bit, HC08-compatible with BGND) | — |
| CPU Frequency | 16 MHz | — |
| Program Memory (Flash) | 4 KB (4K x 8) | — |
| RAM | 256 bytes | 256 B |
| Boîtier | 8-SOIC (0.154", 3.90 mm width) | 8-SOIC |
| Type de montage | Surface Mount | Surface Mount |
| Température de fonctionnement | -40C to +125C (automotive grade) | [DATA_NEEDED: operating temperature range] |
| AEC-Q100 Qualification | Qualified | — |
| Nombre de broches | 8 | — |
| General-Purpose I/O Pins | 4 (plus 1 input-only and 1 output-only pin) | — |
| Tension d'alimentation | [DATA_NEEDED: VDD range] | 3.3 V / 5 V |
| ADC | On-chip ADC (channel count per datasheet) | — |
| Timers | On-chip timer(s) | — |
| Communication | SCI/SPI (per datasheet) | — |
| Debug Interface | Background Debug Mode (BDM) with breakpoints | Background debugging system (single-wire BDM) |
| Low-Power Modes | STOP and WAIT | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | — |
| Core Processor | — | S08 (HCS08), 8-bit CISC |
| Core Size | — | 8-bit |
| Fréquence d'horloge maximale | — | 16 MHz |
| Flash Memory | — | 4 KB (4K x 8) |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 4 |
| General-Purpose I/O | — | 6 |
| Instruction Set | — | HC08 with added BGND instruction |
| Packaging | — | Tube |
| Life Cycle Stage | — | End of Life (per NXP product page) |