SM2263XT vs SM2262EN Comparación

Comparación detallada lado a lado de SM2263XT por Silicon Motion Technology Corp. y SM2262EN por Silicon Motion Technology Corp.. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

Silicon Motion Technology Corp.
SM2263XT SM2263XT - PCIe Gen3 x4 NVMe 1.3 SSD Controller | Silicon Motion

SM2263XT - PCIe Gen3 x4 NVMe 1.3 SSD Controller | Silicon Motion

SM2263XT ✓ Activo
Silicon Motion Technology Corp.
SM2262EN SM2262EN - PCIe 3.1 x4 NVMe 1.3 SSD Controller | Silicon Motion

SM2262EN - PCIe 3.1 x4 NVMe 1.3 SSD Controller | Silicon Motion

SM2262EN ✓ Activo

Comparación de especificaciones

Parámetro SM2263XT SM2262EN
Marca Silicon Motion Technology Corp. Silicon Motion Technology Corp.
Categoría Interface ICs Memory ICs
Estado del ciclo de vida Activo Activo
Estado del stock In Stock In Stock
Precio unitario (USD) $5,85 $0,00
Product Type PCIe Gen3 x4 NVMe 1.3 SSD Controller (DRAMless) PCIe NVMe SSD controller
Manufacturer Silicon Motion Technology Corp. —
Host Interface PCIe Gen3 x4 (NVMe 1.3) PCIe
PCIe Lanes 4 lanes (8 Gbps each) —
NAND Channels 4 channels 8 channels
CE per Channel 4 CE/ch (per third-party SSD teardowns) —
DRAM Cache None (DRAMless; uses NVMe HMB) —
Host Memory Buffer Supported (NVMe HMB feature) —
NAND Support 2D/3D MLC, TLC, QLC; SLC cache —
ECC LDPC hard-decision + soft-decision —
Data Protection End-to-end CRC, hardware RAID —
Encryption AES-256 hardware encryption —
Sequential Read (typical OEM drive) up to 2400 MB/s —
Sequential Write (typical OEM drive) up to 1700 MB/s —
Encapsulado BGA (SSD controller; pinout varies by OEM reference design) —
Tipo de montaje Surface Mount (reflow, OEM SSD assembly only) —
Estado RoHS Compliant (per Silicon Motion product brief) [DATA_NEEDED: RoHS status]
Availability Channel OEM only (not via catalog distributor) —
Typical OEM Capacities 256 GB to 1 TB (M.2 2280 single-sided) —
PCIe Generation — PCIe 3.1
PCIe Lane Configuration — x4
Per-Lane Data Rate — 8 Gbps
NVMe Specification — NVMe 1.3
Process Node — 28 nm TSMC
Architecture — DRAM-less
Package Type — BGA package
Application — PCIe SSD
Storage Protocol — NVMe
Manufacturer Product Brief — SM2262EN product brief
NAND Interface Details — [DATA_NEEDED: NAND interface details]
Maximum Storage Capacity — [DATA_NEEDED: maximum storage capacity]
Rango de temperatura de funcionamiento — [DATA_NEEDED: operating temperature range]
Core Supply Voltage — [DATA_NEEDED: core supply voltage]
I/O Supply Voltage — [DATA_NEEDED: I/O supply voltage]
Package Dimensions — [DATA_NEEDED: package dimensions]
Recuento de pines — [DATA_NEEDED: pin count]
REACH Status — [DATA_NEEDED: REACH status]
Automotive Qualification — [DATA_NEEDED: automotive qualification]

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