SM2263XT vs SM2262EN Comparação

Comparação detalhada lado a lado de SM2263XT por Silicon Motion Technology Corp. e SM2262EN por Silicon Motion Technology Corp.. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

Silicon Motion Technology Corp.
SM2263XT SM2263XT - PCIe Gen3 x4 NVMe 1.3 SSD Controller | Silicon Motion

SM2263XT - PCIe Gen3 x4 NVMe 1.3 SSD Controller | Silicon Motion

SM2263XT ✓ Ativo
Silicon Motion Technology Corp.
SM2262EN SM2262EN - PCIe 3.1 x4 NVMe 1.3 SSD Controller | Silicon Motion

SM2262EN - PCIe 3.1 x4 NVMe 1.3 SSD Controller | Silicon Motion

SM2262EN ✓ Ativo

Comparação de especificações

Parâmetro SM2263XT SM2262EN
Marca Silicon Motion Technology Corp. Silicon Motion Technology Corp.
Categoria Interface ICs Memory ICs
Status do ciclo de vida Ativo Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $5,85 $0,00
Product Type PCIe Gen3 x4 NVMe 1.3 SSD Controller (DRAMless) PCIe NVMe SSD controller
Manufacturer Silicon Motion Technology Corp. —
Host Interface PCIe Gen3 x4 (NVMe 1.3) PCIe
PCIe Lanes 4 lanes (8 Gbps each) —
NAND Channels 4 channels 8 channels
CE per Channel 4 CE/ch (per third-party SSD teardowns) —
DRAM Cache None (DRAMless; uses NVMe HMB) —
Host Memory Buffer Supported (NVMe HMB feature) —
NAND Support 2D/3D MLC, TLC, QLC; SLC cache —
ECC LDPC hard-decision + soft-decision —
Data Protection End-to-end CRC, hardware RAID —
Encryption AES-256 hardware encryption —
Sequential Read (typical OEM drive) up to 2400 MB/s —
Sequential Write (typical OEM drive) up to 1700 MB/s —
Encapsulamento BGA (SSD controller; pinout varies by OEM reference design) —
Tipo de montagem Surface Mount (reflow, OEM SSD assembly only) —
Status RoHS Compliant (per Silicon Motion product brief) [DATA_NEEDED: RoHS status]
Availability Channel OEM only (not via catalog distributor) —
Typical OEM Capacities 256 GB to 1 TB (M.2 2280 single-sided) —
PCIe Generation — PCIe 3.1
PCIe Lane Configuration — x4
Per-Lane Data Rate — 8 Gbps
NVMe Specification — NVMe 1.3
Process Node — 28 nm TSMC
Architecture — DRAM-less
Package Type — BGA package
Application — PCIe SSD
Storage Protocol — NVMe
Manufacturer Product Brief — SM2262EN product brief
NAND Interface Details — [DATA_NEEDED: NAND interface details]
Maximum Storage Capacity — [DATA_NEEDED: maximum storage capacity]
Faixa de temperatura de operação — [DATA_NEEDED: operating temperature range]
Core Supply Voltage — [DATA_NEEDED: core supply voltage]
I/O Supply Voltage — [DATA_NEEDED: I/O supply voltage]
Package Dimensions — [DATA_NEEDED: package dimensions]
Contagem de pinos — [DATA_NEEDED: pin count]
REACH Status — [DATA_NEEDED: REACH status]
Automotive Qualification — [DATA_NEEDED: automotive qualification]

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