SPC5607BF1VLU6 vs SPC5643LFF2MMM1R Comparación
Comparación detallada lado a lado de SPC5607BF1VLU6 por NXP Semiconductors y SPC5643LFF2MMM1R por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
SPC5607BF1VLU6 - 32-bit Qorivva MCU, 1.5MB Flash, 64MHz | NXP (Tape & Reel)
SPC5607BF1VLU6 ✓ ActivoNXP Semiconductors
SPC5643LFF2MMM1R - 120MHz Dual-Core MCU 1MB Flash | NXP
SPC5643LFF2MMM1R ✓ ActivoComparación de especificaciones
| Parámetro | SPC5607BF1VLU6 | SPC5643LFF2MMM1R |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $17,52 | $24,85 |
| Core Architecture | e200z0h (Power Architecture, single-issue, VLE) | Power Architecture® e200z4 (dual-core with delayed lockstep) |
| Core Frequency | 64 MHz | — |
| Program Flash | 1.5 MB | — |
| Data Flash | 64 KB | — |
| SRAM | 80 KB | — |
| Operating Voltage Range | 3.0 V to 5.5 V (single 5 V rail) | [DATA_NEEDED: VDD range, typ. 3.3 V or 5 V I/O] |
| Temperatura de funcionamiento | -40 C to +105 C (AEC-Q100 Grade 1) | — |
| Encapsulado | 176-LQFP (24x24 mm, 0.5 mm pitch) | 257-LFBGA / MAPBGA 14x14 mm |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| ADC | 10-bit, 16 channels | — |
| CAN Controllers | FlexCAN 2.0 (multi-channel) | — |
| LIN/SCI | LINFlex / UART | — |
| GPIO | Up to 120 (package dependent) | — |
| Debug Interface | JTAG / Nexus (NEXUS 2+) | Nexus (JTAG, auxiliary) |
| Automotive Qualification | AEC-Q100 Grade 1 | — |
| Nivel MSL | 3 (per JEDEC J-STD-020) | — |
| Estado RoHS | Compliant | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Series | — | MPC5643L (MPC56xx Qorivva family) |
| Core Count | — | 2 (1 main + 1 lockstep checker) |
| Maximum CPU Clock | — | 120 MHz |
| Program Memory (Flash) | — | 1 MB (1M x 8) |
| Data Memory (SRAM) | — | [DATA_NEEDED: SRAM size] |
| Rango de temperatura de funcionamiento | — | -40 °C to +125 °C (automotive grade) |
| AEC-Q100 Qualification | — | Yes (Automotive qualified per NXP product page) |
| Functional Safety Target | — | ISO 26262 ASIL-D capable (via lockstep + ECC + FCU) |
| Communication Interfaces | — | FlexCAN, SPI, I²C, UART (LIN-capable via SCI) |
| Lead-Free / RoHS | — | Compliant (lead-free BGA) |