SPC5642AF2MVZ3 vs MPCZ565MVR56 Comparación
Comparación detallada lado a lado de SPC5642AF2MVZ3 por NXP Semiconductors y MPCZ565MVR56 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPCZ565MVR56 - 32-bit Power Arch MCU, 1MB Flash, 40MHz | NXP
MPCZ565MVR56 ObsoleteComparación de especificaciones
| Parámetro | SPC5642AF2MVZ3 | MPCZ565MVR56 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $52,75 |
| Device Type | 32-bit automotive microcontroller | — |
| Processor Core | Power Architecture core | — |
| Architecture | 32-bit | — |
| Maximum Operating Frequency | 80 MHz | — |
| Flash Memory | 2 MB | — |
| Flash Organization | 2M x 8 bits | — |
| Family | MPC56xx Qorivva | — |
| Rango de temperatura de funcionamiento | -40°C to +105°C | -40C to +125C |
| Temperature Grade | Automotive Grade | — |
| Package Type | PBGA-324 | — |
| Package Body Size | 23 mm x 23 mm | — |
| Terminal Form | Ball | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Intended Applications | Powertrain, chassis, engine control, transmission control, and industrial applications | — |
| Tensión de alimentación | [DATA_NEEDED: Supply Voltage] | — |
| RAM Memory | [DATA_NEEDED: RAM Memory] | — |
| Number of I/O Pins | [DATA_NEEDED: Number of I/O Pins] | [DATA_NEEDED: exact I/O count] |
| Security and Diagnostics Features | [DATA_NEEDED: Security and Diagnostics Features] | — |
| Core Architecture | — | Power Architecture (MPC500 family) |
| Ancho del bus de datos | — | 32-bit |
| Program Memory Size | — | 1 MB Flash |
| RAM Size | — | 64 KB [DATA_NEEDED: exact value] |
| Frecuencia de reloj máxima | — | 40 MHz |
| Supply Voltage Range | — | [DATA_NEEDED: Vdd/Vdd range] |
| Encapsulado / Carcasa | — | 388-ball PBGA |
| Floating Point Unit | — | Yes (IEEE 754) |
| CAN Controllers | — | 2 (CAN 2.0B) |
| ADC Channels | — | 40 (QADC) |
| Timers | — | 32 channels eMIOS + TPU [DATA_NEEDED: exact TPU count] |
| Debug Interface | — | JTAG / OnCE / BDM |
| Nivel de sensibilidad a la humedad (MSL) | — | 3 |
| Peak Reflow Temperature | — | 260C (40s max) |
| Terminal Finish | — | Tin Silver Copper (e1 per JESD-609) |
| Automotive Grade | — | Yes |
| Process Technology | — | 0.25 micron CMOS |