SPC5645SF1VVU vs MPXS3010VMM150 Comparación
Comparación detallada lado a lado de SPC5645SF1VVU por NXP Semiconductors y MPXS3010VMM150 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
SPC5645SF1VVU - 32-bit MCU, 2MB Flash, 125MHz, 416-PBGA | NXP
SPC5645SF1VVU ✓ ActivoNXP Semiconductors
MPXS3010VMM150 - PXS30 Dual-Core 150MHz MCU, 1MB Flash, 257-LFBGA | NXP
MPXS3010VMM150 ✓ ActivoComparación de especificaciones
| Parámetro | SPC5645SF1VVU | MPXS3010VMM150 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $27,10 | $23,95 |
| Core Architecture | Power Architecture e200z4d (dual-core lockstep option) | Power Architecture e200z7d (dual-core) |
| Ancho del bus de datos | 32-bit | — |
| Frecuencia de reloj máxima | 125 MHz | — |
| Program Memory Size | 2 MB Flash | — |
| Program Memory Type | Flash with ECC | — |
| SRAM Size | [DATA_NEEDED: SRAM size in KB] | — |
| Tensión de alimentación | 3.3 V / 5 V tolerant I/O | — |
| Rango de temperatura de funcionamiento | -40 C to +105 C | — |
| Encapsulado / Carcasa | 416-PBGA (27x27 mm, 1.0 mm pitch) | 257-LFBGA (14x14 mm) |
| Tipo de montaje | Surface Mount | Surface Mount |
| AEC-Q100 Qualification | Yes (Automotive Grade) | — |
| Functional Safety | Targeting ASIL-D (dual-core lockstep) | — |
| CAN Controllers | Dual CAN 2.0B (FlexCAN) | — |
| FlexRay | Yes, dual-channel FlexRay module | — |
| Ethernet | [DATA_NEEDED: Ethernet MAC availability] | — |
| Graphics Accelerator | Yes, integrated GFXPU for TFT cluster | — |
| ADC | 12-bit ADC, multi-channel | — |
| Timers | eMIOS unified channels | — |
| Debug Interface | JTAG / Nexus 5001 (Level 3 trace) | — |
| Estado RoHS | Compliant | [DATA_NEEDED: rohs status] |
| Process Technology | 90 nm CMOS | — |
| JEDEC MSL | MSL3 (per PBGA JEDEC J-STD-020) | — |
| Number of Cores | — | 2 |
| Core Bit Width | — | 32-bit |
| Maximum CPU Clock | — | 150 MHz |
| Program Memory (Flash) | — | 1 MB (1M x 8) |
| RAM Size | — | 256 KB (256K x 8) |
| Oscillator Type | — | External (per datasheet) |
| Terminal Form | — | BALL (BGA) |
| Number of Terminals | — | 257 |
| Package Code | — | LFBGA |
| Temperature Grade | — | INDUSTRIAL |
| Series | — | PXS30 |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |