SPC5645SF1VVU vs MPXS3010VMM150 Comparaison
Comparaison détaillée côte à côte de SPC5645SF1VVU par NXP Semiconductors et MPXS3010VMM150 par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
SPC5645SF1VVU - 32-bit MCU, 2MB Flash, 125MHz, 416-PBGA | NXP
SPC5645SF1VVU ✓ ActifNXP Semiconductors
MPXS3010VMM150 - PXS30 Dual-Core 150MHz MCU, 1MB Flash, 257-LFBGA | NXP
MPXS3010VMM150 ✓ ActifComparaison des spécifications
| Paramètre | SPC5645SF1VVU | MPXS3010VMM150 |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $27,10 | $23,95 |
| Core Architecture | Power Architecture e200z4d (dual-core lockstep option) | Power Architecture e200z7d (dual-core) |
| Largeur du bus de données | 32-bit | — |
| Fréquence d'horloge maximale | 125 MHz | — |
| Program Memory Size | 2 MB Flash | — |
| Program Memory Type | Flash with ECC | — |
| SRAM Size | [DATA_NEEDED: SRAM size in KB] | — |
| Tension d'alimentation | 3.3 V / 5 V tolerant I/O | — |
| Plage de température de fonctionnement | -40 C to +105 C | — |
| Boîtier / Format | 416-PBGA (27x27 mm, 1.0 mm pitch) | 257-LFBGA (14x14 mm) |
| Type de montage | Surface Mount | Surface Mount |
| AEC-Q100 Qualification | Yes (Automotive Grade) | — |
| Functional Safety | Targeting ASIL-D (dual-core lockstep) | — |
| CAN Controllers | Dual CAN 2.0B (FlexCAN) | — |
| FlexRay | Yes, dual-channel FlexRay module | — |
| Ethernet | [DATA_NEEDED: Ethernet MAC availability] | — |
| Graphics Accelerator | Yes, integrated GFXPU for TFT cluster | — |
| ADC | 12-bit ADC, multi-channel | — |
| Timers | eMIOS unified channels | — |
| Debug Interface | JTAG / Nexus 5001 (Level 3 trace) | — |
| Statut RoHS | Compliant | [DATA_NEEDED: rohs status] |
| Process Technology | 90 nm CMOS | — |
| JEDEC MSL | MSL3 (per PBGA JEDEC J-STD-020) | — |
| Number of Cores | — | 2 |
| Core Bit Width | — | 32-bit |
| Maximum CPU Clock | — | 150 MHz |
| Program Memory (Flash) | — | 1 MB (1M x 8) |
| RAM Size | — | 256 KB (256K x 8) |
| Oscillator Type | — | External (per datasheet) |
| Terminal Form | — | BALL (BGA) |
| Number of Terminals | — | 257 |
| Package Code | — | LFBGA |
| Temperature Grade | — | INDUSTRIAL |
| Series | — | PXS30 |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |