SPC5645SF1VVU vs SPC5746BSK1MKU2 Comparación
Comparación detallada lado a lado de SPC5645SF1VVU por NXP Semiconductors y SPC5746BSK1MKU2 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
SPC5645SF1VVU - 32-bit MCU, 2MB Flash, 125MHz, 416-PBGA | NXP
SPC5645SF1VVU ✓ ActivoNXP Semiconductors
SPC5746BSK1MKU2 - 120MHz 32-bit Automotive MCU 3MB | NXP
SPC5746BSK1MKU2 ✓ ActivoComparación de especificaciones
| Parámetro | SPC5645SF1VVU | SPC5746BSK1MKU2 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $27,10 | $17,25 |
| Core Architecture | Power Architecture e200z4d (dual-core lockstep option) | — |
| Ancho del bus de datos | 32-bit | 32 bit |
| Frecuencia de reloj máxima | 125 MHz | 120 MHz |
| Program Memory Size | 2 MB Flash | — |
| Program Memory Type | Flash with ECC | — |
| SRAM Size | [DATA_NEEDED: SRAM size in KB] | — |
| Tensión de alimentación | 3.3 V / 5 V tolerant I/O | — |
| Rango de temperatura de funcionamiento | -40 C to +105 C | — |
| Encapsulado / Carcasa | 416-PBGA (27x27 mm, 1.0 mm pitch) | LQFP-176 (24x24 mm) |
| Tipo de montaje | Surface Mount | — |
| AEC-Q100 Qualification | Yes (Automotive Grade) | — |
| Functional Safety | Targeting ASIL-D (dual-core lockstep) | — |
| CAN Controllers | Dual CAN 2.0B (FlexCAN) | — |
| FlexRay | Yes, dual-channel FlexRay module | — |
| Ethernet | [DATA_NEEDED: Ethernet MAC availability] | — |
| Graphics Accelerator | Yes, integrated GFXPU for TFT cluster | — |
| ADC | 12-bit ADC, multi-channel | — |
| Timers | eMIOS unified channels | — |
| Debug Interface | JTAG / Nexus 5001 (Level 3 trace) | — |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Process Technology | 90 nm CMOS | — |
| JEDEC MSL | MSL3 (per PBGA JEDEC J-STD-020) | — |
| Core Processor | — | e200z4 (Power Architecture) |
| Core Size | — | 32-bit |
| Number of Cores | — | 1 (single core) |
| Flash Memory | — | 3 MB (3M x 8) |
| Data RAM Size | — | 384 kB |
| ADC Resolution | — | 10 bit, 12 bit |
| Number of I/Os | — | 129 I/O |
| Supply Voltage (Core) | — | 1.2 V to 1.32 V |
| Connectivity | — | FlexRay |
| Temperatura de funcionamiento | — | -40C to +125C |
| Qualification | — | Automotive Qualified |
| Estilo de montaje | — | SMD/SMT |
| Product Family | — | MPC574xB/C/G (SPC57xx) |
| Moisture Sensitivity | — | [DATA_NEEDED: MSL level] |