SPC5746BSK1MKU2 - 120MHz 32-bit Automotive MCU 3MB | NXP
N.º de pieza: SPC5746BSK1MKU2 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $22.98 | $22,98 |
| 10 | $21.6 | $216,00 |
| 100 | $19.85 | $1.985,00 |
| 500 | $18.4 | $9.200,00 |
| 1.000 | $17.25 | $17.250,00 |
SPC5746BSK1MKU2 Descripción general
A 32-bit microcontroller is a single-chip computer that integrates a processor core, memory, and peripherals such as ADCs, timers, and communication controllers on one die. Within the power management IC and embedded processor hierarchy, automotive MCUs like this one form the compute layer of electronic control units (ECUs), sitting above discrete sensors and below central gateways in the vehicle electronics architecture.
Key features include the Power Architecture e200z4 32-bit core at 120 MHz, 3 MB (3M x 8) on-chip flash for code and calibration data, 384 kB of SRAM, and a FlexRay communication controller for deterministic, time-triggered in-vehicle networking. The device integrates 10-bit and 12-bit ADC resolution options and provides 129 general-purpose I/O lines, enabling dense sensor and actuator connectivity in a single chip.
The SPC5746B is automotive qualified and rated for operation from -40C to +125C ambient, meeting the environmental requirements of under-hood and body-control ECUs. The operating supply voltage window of 1.2 V to 1.32 V applies to the core domain, with on-chip regulation from the standard 3.3 V/5 V board rails. The LQFP-176 surface-mount package simplifies inspection and rework compared with ball-grid alternatives, supporting conventional assembly lines.
Typical applications include central body control modules, vehicle gateways, industrial control systems, and safety-oriented nodes that require FlexRay or CAN connectivity combined with substantial flash capacity for diagnostic stacks and OTA-capable firmware.
When designing with this device, budget the pin count early: with 129 I/O on a 176-pin package, a large share of pins are shared analog/digital functions, so pin muxing must be finalized before PCB layout. Decoupling the 1.2 V core supply with low-ESR ceramics close to the ball-side pins is essential for EMC performance in automotive environments.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, verified against live web data as of 2026-10-18.
Alternativas directas para SPC5746BSK1MKU2 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con SPC5746BSK1MKU2 (mismo factor de forma y huella) — difiere en Core Architecture, Package, Operating Temperature Range, Program Memory Size, RoHS Status.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
SPC5746BSK1MKU2R
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
SPC5746BSK1AMKU2
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
SPC5746CSK1MKU6R
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
SPC5746BHK1AMKU6
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
SPC5746CBK1AMMJ6
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
SPC5746BSK1MKU2 Valores máximos y características eléctricas
| Core Processor | e200z4 (Power Architecture) |
| Core Size | 32-bit |
| Number of Cores | 1 (single core) |
| Frecuencia de reloj máxima | 120 MHz |
| Flash Memory | 3 MB (3M x 8) |
| Data RAM Size | 384 kB |
| ADC Resolution | 10 bit, 12 bit |
| Number of I/Os | 129 I/O |
| Supply Voltage (Core) | 1.2 V to 1.32 V |
| Ancho del bus de datos | 32 bit |
| Connectivity | FlexRay |
| Temperatura de funcionamiento | -40C to +125C |
| Qualification | Automotive Qualified |
| Encapsulado / Carcasa | LQFP-176 (24x24 mm) |
| Estilo de montaje | SMD/SMT |
| Product Family | MPC574xB/C/G (SPC57xx) |
Guía de configuración de pines de SPC5746BSK1MKU2 lqfp-176 (24x24 mm)
Configuración de pines para SPC5746BSK1MKU2 (encapsulado lqfp-176 (24x24 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para SPC5746BSK1MKU2.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
SPC5746BSK1MKU2 es adecuado para 6 aplicacións: Central Body Control Module (BCM), Vehicle Gateway ECU, Industrial Control and Automation, Chassis and Safety-Oriented Nodes, Battery Management and Powertrain Supervision, Lighting Front-Module Control.
Central Body Control Module (BCM)
The SPC5746BSK1MKU2 fits central body control ECUs because it couples a 120 MHz e200z4 core with 3 MB of flash, enough to host the full lighting, wiper, door, and access-control logic plus UDS diagnostics and network management stacks simultaneously. Its 129 I/O lines directly drive the dozens of relay, LED, and switch interfaces typical of a BCM, reducing external I/O expanders. With -40C to +125C automotive qualification, it survives interior and engine-bay-adjacent environments. Placed as the master node on the LIN/CAN body network with FlexRay available for the backbone, the MCU schedules time-critical functions deterministically. The 384 kB SRAM comfortably holds dual-bank flash programming buffers, enabling OTA-style firmware updates without an external memory.
Recomendado
Vehicle Gateway ECU
In gateway modules, the SPC5746BSK1MKU2's FlexRay controller plus its family-standard CAN/LIN peripherals let one chip bridge time-triggered and event-triggered domains. According to NXP, the MPC574xB/C/G family was designed explicitly for gateway and central body control applications, giving the SPC5746B first-class routing performance: the 120 MHz core performs protocol translation and firewalling while 384 kB of SRAM buffers burst traffic between 10 Mbit/s FlexRay frames and multi-channel CAN. The 3 MB flash stores routing tables, security credentials, and diagnostic layers. The 176-pin LQFP supplies sufficient I/O for mixed-topology physical layers, and the -40C to +125C grade suits gateway modules mounted near heat sources.
Recomendado
Industrial Control and Automation
For industrial control nodes, the SPC5746BSK1MKU2 offers a 120 MHz single-issue core with deterministic interrupt latency, 3 MB of flash for protocol stacks and application logic, and 10/12-bit ADC resolution for sensor acquisition. Its 129 I/O lines interface PLC-style digital inputs and outputs, while the FlexRay controller is also used in industrial real-time networks derived from automotive designs. The -40C to +125C operating range covers unventilated control cabinets and outdoor enclosures. Because the device is SMD/SMT in a conventional LQFP-176, standard industrial assembly processes apply, avoiding the stricter x-ray inspection regimes required by BGA packages, which shortens prototyping and repair cycles in low-to-mid volume industrial products.
Recomendado
Chassis and Safety-Oriented Nodes
Chassis-domain ECUs benefit from the SPC5746BSK1MKU2's combination of a lockstep-capable family architecture, 120 MHz real-time performance, and FlexRay's 10 Mbit/s deterministic communication for suspension, steering-assist support, and brake-related network interfaces. The 10/12-bit ADCs sample position and pressure sensors at rates sufficient for millisecond control loops, while 384 kB SRAM holds loop state and diagnostic history. The MPC574xB/C/G family adds functional-safety support features such as hardware supervision, and NXP documents safety concepts for the family in its safety manuals. The -40C to +125C qualification addresses under-hood mounting, and the LQFP-176's exposed pin ring eeps thermal resistance manageable at moderate loads.
Recomendado
Battery Management and Powertrain Supervision
Powertrain supervision and battery-management masters exploit the SPC5746BSK1MKU2's 12-bit ADC paths for cell-voltage and current telemetry, its 120 MHz core for state-of-charge and state-of-health algorithms, and its 3 MB flash for calibration tables across temperature and aging conditions. The FlexRay and CAN interfaces communicate pack status to the vehicle gateway deterministically, while 129 I/O manage contactor drivers, isolation-monitoring enable lines, and interlock signals. The -40C to +125C grade tolerates battery-box temperature excursions. Dual-bank flash architecture lets the MCU rewrite one bank while executing from the other, supporting calibration updates in the field without a bench visit.
Recomendado
Lighting Front-Module Control
Adaptive front-lighting and LED matrix controllers use the SPC5746BSK1MKU2's 129 I/O to drive and monitor LED driver enables, stepper/servo positioning channels, and fault-feedback lines. The 120 MHz e2004z core executes beam-pattern algorithms with the sub-millisecond cycle times demanded by dynamic bending lights, and 3 MB flash stores multiple beam-profile calibrations per vehicle variant. LIN/CAN connectivity receives steering-angle and vehicle-speed inputs, while FlexRay support future-proofs the module for chassis-networked lighting. The -40C to +125C range handles headlamp-assembly heat soak, and the 12-bit ADC reads diagnostic currents for open/short detection required by lighting regulations.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para SPC5746BSK1MKU2 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | SPC5746BSK1MKU2R | SPC5746BSK1AMKU2 | SPC5746CSK1MKU6R | SPC5746BHK1AMKU6 | SPC5746CBK1AMMJ6 |
|---|---|---|---|---|---|---|
| Package | LQFP-176 (24x24 mm) | LQFP-176 (24x24 mm) - same | LQFP-176 (24x24 mm) - same | LQFP-176 (24x24 mm) - same | LQFP-176 (24x24 mm) - same | LQFP-176 (24x24 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core / Frequency | e200z4, 120 MHz | e200z4, 120 MHz | e200z4, 120 MHz | e200z4, 120 MHz | e200z4, 120 MHz | e200z4, 120 MHz |
| Flash Memory | 3 MB | 3 MB | 3 MB | 3 MB | 3 MB | 3 MB |
| FlexRay | Yes | Yes | Yes | Yes | Yes | Yes |
| Automotive Qualification | Yes (-40C to +125C) | Yes | Yes | Yes | Yes | Yes |
| Functional Safety Features (HSM/safety manual) | Family safety features (B-grade) | Same as this product | Same as this product | C-grade: extended safety configuration | Family safety features | C-grade with HSM, documented functional-safety support |
Diferenciadores clave
- Latest silicon attribute grade within the B-series ordering family (frente a SPC5746BSK1AMKU2)
- Tray packaging suits programming and test-house workflows (frente a SPC5746BSK1MKU2R)
- B-grade cost position vs C-grade safety platform (frente a SPC5746CSK1MKU6R)
Notas de diseño
The SPC5746BSK1MKU2 core domain requires 1.2 V to 1.32 V; pair it with an NXP system basis chip such as the MC33907 (used in NXP reference designs for MPC574x) to handle pre-regulation, sequencing, and windowed watchdog supervision. Decouple each core-supply pin pair with 100 nF ceramics plus bulk 10 uF near the regulator output. Estimated: at 120 MHz the core current is on the order of a few hundred mA (see the datasheet current-consumption table for your exact clock and peripheral configuration), so size the 1.2 V rail converter with margin above the datasheet worst-case figure.
The 24x24 mm LQFP-176 has a 0.5 mm pin pitch; fan out with 0.15 mm trace/0.15 mm space under the body or escape on inner layers. Place the crystal/resonator for the PLL reference within 10 mm of the OSC pins with guard ground. Route FlexRay and CAN differential pairs at 100 ohm differential impedance with matched lengths. Because 129 of 176 pins are I/O with analog/digital muxing, lock the pin multiplexing in NXP's configuration tool before layout release - re-muxing after tape-out typically forces a PCB respin.
Common pitfalls: (1) treating the 1.2 V spec as the board input voltage - the board must supply the appropriate pre-regulated rails per the NXP power architecture in the datasheet; (2) omitting the NRST supervisor - the MPC574x family requires correct reset sequencing handled by the SBC; (3) ignoring errata sheets - automotive MCU errata can affect FlexRay and flash programming; check the NXP errata document for your silicon revision (the ordering-code letter indicates it); (4) mixing silicon revisions in production - verify the exact suffix (A vs non-A in SPC5746BSK1AMKU2 vs SPC5746BSK1MKU2) matches your validated firmware.
Información de cumplimiento
Verified web data states 'Automotive Qualified' but does not enumerate RoHS/REACH/AEC-Q100 status. Automotive qualification is asserted by Jotrin ('Automotive Qualified, -40C > 125C'); formal AEC-Q100 grade should be confirmed on the NXP product page before design-in.
