STM32F767BIT6 vs STM32F767IGK6 Comparación
Comparación detallada lado a lado de STM32F767BIT6 por STMicroelectronics y STM32F767IGK6 por STMicroelectronics. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
STMicroelectronics
STM32F767BIT6 - ARM Cortex-M7 MCU, 2MB Flash, 216MHz | STMicroelectronics
STM32F767BIT6 ✓ ActivoSTMicroelectronics
STM32F767IGK6 - 216MHz Cortex-M7 MCU 1MB Flash 176+25UFBGA
STM32F767IGK6 ✓ ActivoComparación de especificaciones
| Parámetro | STM32F767BIT6 | STM32F767IGK6 |
|---|---|---|
| Marca | STMicroelectronics | STMicroelectronics |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $11,85 | $14,05 |
| Core | ARM Cortex-M7 with FPU + DSP instructions | — |
| Maximum CPU Clock | 216 MHz | — |
| DMIPS | 462 DMIPS (2.14 DMIPS/MHz, Dhrystone 2.1) | — |
| Program Flash | 2 MB (single-bank, 32-bit fetch) | 1 MB (1M x 8) |
| SRAM | 384 KB DTCM + 128 KB SRAM + 4 KB backup SRAM | 512 KB (including 16 KB I-cache + 16 KB D-cache) |
| L1 Cache | 16 KB I-cache + 16 KB D-cache | — |
| ART Accelerator | Yes (0-wait-state execution from Flash) | — |
| Operating Voltage | 1.7 V to 3.6 V | 1.7 V to 3.6 V |
| Encapsulado | 208-LQFP (28x28 mm), 0.5 mm pitch | 176+25 UFBGA (10 x 10 mm, ball grid) |
| I/O Pins (max) | 162 GPIOs | — |
| ADC | 3 x 12-bit, up to 2.4 MSPS each | — |
| DAC | 2 x 12-bit | — |
| Timers | up to 18 channels incl. 32-bit, IC/OC, PWM | Up to 18 (including 32-bit and motor-control timers) |
| USB | USB 2.0 OTG FS + HS with integrated HS PHY | — |
| CAN | 2 x CAN 2.0B | — |
| Crypto / Hash | AES-256, SHA-1/2, TRNG (hardware) | — |
| External Memory Bus | SDRAM (up to 32-bit) + SRAM/PSRAM/NOR/NAND | — |
| Display Controller | LCD-TFT, up to 1024x768 + DMA2D | — |
| Octo-SPI / Quad-SPI | 1 x Octo-SPI / 1 x Quad-SPI | — |
| Temperatura de funcionamiento | -40°C to +85°C (Grade 6) | -40 C to +85 C (Grade 6 suffix) |
| Tipo de montaje | Surface Mount | — |
| Nivel MSL | 3 (per JEDEC J-STD-020) | — |
| Estado RoHS | Compliant | Compliant |
| Core Architecture | — | ARM Cortex-M7 with FPU + DSP |
| Maximum CPU Frequency | — | 216 MHz |
| DMIPS / CoreMark | — | 462 DMIPS / 1082 CoreMark (per ST datasheet DM00273119 family docs) |
| I/O Pins | — | 140 (in 176-pin package variant) |
| Package Pin Count | — | 176 functional + 25 ancillary balls = 201 balls total |
| Communication Interfaces | — | USB OTG FS/HS, CAN 2.0B x2, Ethernet MAC 10/100, SDMMC x2, USART/UART x8, SPI x6, I2C x4, SAI x2 |
| Analog | — | 3x 12-bit ADC (2.4 MSPS each), 2x 12-bit DAC, temperature sensor, Vrefint |
| Graphics Acceleration | — | LTDC + DMA2D (Chrom-ART Accelerator) |
| Cryptography | — | AES-256, SHA-256, HMAC, TRNG (RNG) |
| Datasheet Family Document | — | STM32F765xx/F767xx/F768Ax/F769xx datasheet (document covers 176-pin LQFP/BGA variants of STM32F767IG) |
| Ordering Code Top Mark | — | STM32F767IGK6 - plastic UFBGA 10x10 mm, 176 pins, Grade 6 temperature, tape & reel |