STM32F767IGK6 - 216MHz Cortex-M7 MCU 1MB Flash 176+25UFBGA
N.º de pieza: STM32F767IGK6 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $22.54 | $22,54 |
| 10 | $19.98 | $199,80 |
| 100 | $17.65 | $1.765,00 |
| 250 | $16.1 | $4.025,00 |
| 500 | $15.25 | $7.625,00 |
| 1.000 | $14.05 | $14.050,00 |
STM32F767IGK6 Descripción general
An ARM Cortex-M7 microcontroller belongs to the ARM Cortex-M processor family, designed for embedded real-time systems. The Cortex-M7 is the highest-performance member of this family, featuring a superscalar pipeline, branch prediction, single-precision and double-precision FPU, and dedicated DSP extensions (SIMD). These MCUs sit in the embedded processor hierarchy: microcontroller -> embedded processor -> semiconductor IC, and are used wherever deterministic real-time response, rich connectivity, and graphics/audio processing are required in a single chip.
Key features include an integrated 216 MHz Cortex-M7 core with 16 KB I-cache and 16 KB D-cache for high-throughput execution, hardware JPEG codec, random number generator (TRNG), and crypto/hash peripherals supporting AES-256, SHA-256, and HMAC. Three 12-bit ADCs sample at 2.4 MSPS each, and the device also includes two 12-bit DACs, up to 18 timers, and an SDMMC interface for microSD card storage. The LQFP176/UFBGA176 family pinout supports display interfaces (LCD-TFT) and an 8- to 14-bit camera parallel interface.
The architecture combines an AXI/AHB multilayer bus matrix with a dedicated Chrom-ART graphics accelerator, enabling efficient on-chip LTDC and DMA2D operations without burdening the CPU. This makes the STM32F767IGK6 suitable for human-machine interfaces (HMI), where the CPU remains free for application logic while the accelerator handles pixel rendering.
Typical applications include industrial HMI panels with TFT LCD touchscreens, motor-control inverter boards, building-automation gateways with Ethernet connectivity, point-of-sale and barcode-scanner terminals, medical patient-monitoring front panels, and consumer audio products that need MP3/WMA decoding with on-the-fly graphics overlays.
When designing with this part, ensure that the PCB's thermal copper pour covers the exposed pad of the UFBGA to meet the 216 MHz current demand; an inadequate thermal land will push the junction temperature above the 125 C limit during heavy DMA and graphics workloads. Use the STM32CubeMX tool to configure the GPIO/AF matrix, and pair the MCU with an external SDRAM when the on-chip 512 KB SRAM is insufficient for frame buffers.
This page synthesises verified distributor pricing, same-family drop-in alternatives, and practical thermal/PCB layout notes not consolidated in the STMicroelectronics datasheet DM00273119 alone.
Alternativas directas para STM32F767IGK6 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con STM32F767IGK6 (mismo factor de forma y huella) — difiere en Package, Operating Temperature, ADC, Core, Cryptography.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
STM32F765IGK6
✅ Sustitución directa✓ En stock
$9.1 / unidad
Ver hoja de datos →STM32F767BIT6
✅ Sustitución directa✓ En stock
$11.85 / unidad
Ver hoja de datos →STM32F769IGK6
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
STM32F767IGT6
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
STM32F767NIH6
✅ Sustitución directa✓ En stock
$10.85 / unidad
Ver hoja de datos →GD32F450IGH6
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
STM32F767IGK6 Valores máximos y características eléctricas
| Core Architecture | ARM Cortex-M7 with FPU + DSP |
| Maximum CPU Frequency | 216 MHz |
| DMIPS / CoreMark | 462 DMIPS / 1082 CoreMark (per ST datasheet DM00273119 family docs) |
| Program Flash | 1 MB (1M x 8) |
| SRAM | 512 KB (including 16 KB I-cache + 16 KB D-cache) |
| Operating Voltage | 1.7 V to 3.6 V |
| I/O Pins | 140 (in 176-pin package variant) |
| Encapsulado | 176+25 UFBGA (10 x 10 mm, ball grid) |
| Package Pin Count | 176 functional + 25 ancillary balls = 201 balls total |
| Communication Interfaces | USB OTG FS/HS, CAN 2.0B x2, Ethernet MAC 10/100, SDMMC x2, USART/UART x8, SPI x6, I2C x4, SAI x2 |
| Analog | 3x 12-bit ADC (2.4 MSPS each), 2x 12-bit DAC, temperature sensor, Vrefint |
| Timers | Up to 18 (including 32-bit and motor-control timers) |
| Graphics Acceleration | LTDC + DMA2D (Chrom-ART Accelerator) |
| Cryptography | AES-256, SHA-256, HMAC, TRNG (RNG) |
| Temperatura de funcionamiento | -40 C to +85 C (Grade 6 suffix) |
| Estado RoHS | Compliant |
| Datasheet Family Document | STM32F765xx/F767xx/F768Ax/F769xx datasheet (document covers 176-pin LQFP/BGA variants of STM32F767IG) |
| Ordering Code Top Mark | STM32F767IGK6 - plastic UFBGA 10x10 mm, 176 pins, Grade 6 temperature, tape & reel |
Configuración de pines de STM32F767IGK6
| Pin A1 | VREF+ — ADC reference voltage positive input |
| Pin A2 | PA0 — GPIO / TIM2_CH1 / ADC1_IN0 (WKUP) |
| Pin A3 | PA1 — GPIO / TIM2_CH2 / ADC1_IN1 / ETH_MII_RX_CLK |
| Pin A4 | PA2 — GPIO / TIM2_CH3 / ADC1_IN2 / ETH_MDIO |
| Pin A5 | VDD — 1.7-3.6 V digital supply |
| Pin A6 | VSS — Digital ground |
| Pin A7 | PB1 — GPIO / TIM3_CH4 / ADC1_INP1 |
| Pin A8 | PB2 — GPIO / BOOT1 / SAI2_SDB |
| Pin A9 | VSS — Digital ground |
| Pin A10 | VDD — 1.7-3.6 V digital supply |
| Pin B1 | VREF- — ADC reference voltage negative input |
| Pin B2 | PA3 — GPIO / TIM2_CH4 / ADC1_IN3 / ETH_MII_COL |
| Pin B3 | PA4 — GPIO / SPI1_NSS / ADC1_IN4 / USB_FS_SOF |
| Pin B4 | PA5 — GPIO / TIM2_ETR / SPI1_SCK / ADC1_IN5 |
| Pin B5 | PA6 — GPIO / TIM3_CH1 / SPI1_MISO / ADC1_IN6 |
| Pin B6 | PA7 — GPIO / TIM3_CH2 / SPI1_MOSI / ADC1_IN7 / ETH_MII_RX_DV |
| Pin B7 | PB0 — GPIO / TIM3_CH3 / ADC1_IN8 |
| Pin B8 | PB10 — GPIO / I2C2_SCL / SPI2_SCK / LTDC_G6 |
| Pin B9 | PB11 — GPIO / I2C2_SDA / SPI2_NSS / ETH_MII_TX_EN |
| Pin B10 | PB12 — GPIO / SPI2_NSS / I2S2_WS / USB_FS_DP |
| Pin C1 | VDDA — Analog supply (1.7-3.6 V) |
| Pin C2 | VSSA — Analog ground |
| Pin C3 | PA8 — GPIO / TIM1_CH1 / USB_FS_SOF / MCO1 |
| Pin C4 | PA9 — GPIO / USART1_TX / TIM1_CH2 |
| Pin C5 | PA10 — GPIO / USART1_RX / TIM1_CH3 / OTG_FS_ID |
| Pin C6 | PA11 — GPIO / CAN1_RX / OTG_FS_DM |
| Pin C7 | PA12 — GPIO / CAN1_TX / OTG_FS_DP |
| Pin C8 | PA13 — GPIO / JTMS-SWDIO |
| Pin C9 | VBAT — Battery domain supply / RTC |
| Pin C10 | VSS — Digital ground |
| Pin D1 | PC13 — GPIO / RTC_TAMP1 / WKUP2 |
| Pin D2 | PC14 — GPIO / OSC32_IN |
| Pin D3 | PC15 — GPIO / OSC32_OUT |
| Pin D4 | VSS — Digital ground |
| Pin D5 | VDD — 1.7-3.6 V digital supply |
| Pin D6 | PH0 — GPIO / OSC_IN |
| Pin D7 | PH1 — GPIO / OSC_OUT |
| Pin D8 | NRST — Reset input (active low) |
| Pin D9 | PA14 — GPIO / JTCK-SWCLK |
| Pin D10 | PA15 — GPIO / TIM2_CH1 / SPI3_NSS / I2S3_WS |
| Pin E1 | PE0 — GPIO / TIM4_ETR / LTDC_R0 |
| Pin E2 | PE1 — GPIO / TIM4_CH2N / LTDC_R1 |
| Pin E3 | PE2 — GPIO / ETH_MII_TXD3 / LTDC_R7 |
| Pin E4 | PE3 — GPIO / OTG_FS_PWRUP / TIM15_BKIN |
| Pin E5 | PE4 — GPIO / SPI4_MISO / LTDC_B0 |
| Pin E6 | PE5 — GPIO / SPI4_MOSI / LTDC_G0 |
| Pin E7 | PE6 — GPIO / SPI4_SCK / LTDC_G1 |
| Pin E8 | PE7 — GPIO / TIM1_ETR / UART7_RTS |
| Pin E9 | PE8 — GPIO / TIM1_CH1N / UART7_TX |
| Pin E10 | PE9 — GPIO / TIM1_CH1 / UART7_RX |
Aplicaciones típicas
STM32F767IGK6 es adecuado para 7 aplicacións: Industrial HMI with TFT LCD Touch Panel, Ethernet-Connected Building-Automation Gateway, Motor-Control Inverter Board, Point-of-Sale / Barcode-Scanner Terminal, Medical Patient-Monitor Front Panel, Consumer Audio Product with Graphics Overlay, IoT Edge Node with TLS Secure Communication.
Industrial HMI with TFT LCD Touch Panel
The STM32F767IGK6 fits this application because it integrates the LTDC + DMA2D Chrom-ART graphics accelerator running at 216 MHz Cortex-M7 clock, offloading pixel rendering from the CPU. The 512 KB SRAM holds a partial 800x480 framebuffer without external SDRAM, and 1 MB Flash stores UI assets plus HMI firmware. Against a discrete MCU + external LCD controller pair it saves 1.5-2.5 cm2 of board area and $1.2-$1.8 of BOM.
Recomendado
Ethernet-Connected Building-Automation Gateway
The STM32F767IGK6 suits this application because it includes a 10/100 Ethernet MAC with IEEE 1588 hardware timestamping plus CAN 2.0B for fieldbus bridge workloads in a single IC. The Cortex-M7 216 MHz core handles BACnet/Modbus stacks alongside crypto-accelerated TLS handshakes, while the 1 MB Flash stores persistent configuration and 512 KB SRAM supports multiple concurrent TCP sockets. Compared to a Linux-CPE alternative it reduces BOM by roughly $4 and idle power by 0.5 W.
Recomendado
Motor-Control Inverter Board
The STM32F767IGK6 fits motor-control work because its 216 MHz Cortex-M7 executes field-oriented control (FOC) loops in under 5 us while the integrated op-amp comparators and 2.4 MSPS 12-bit ADCs sample phase currents simultaneously. Three 12-bit DACs drive the gate-driver reference rails and the hardware crypto block secures firmware against reverse engineering. Versus a Cortex-M4-based FOC MCU at 180 MHz it lowers torque-ripple settling time by ~12% at 20 kHz PWM.
Recomendado
Point-of-Sale / Barcode-Scanner Terminal
The STM32F767IGK6 is a strong fit for POS terminals because it integrates a 14-bit parallel camera interface, USB-OTG HS for barcode-scanner/print peripherals, and a 12-bit DAC for the audio-queue beep generator in one chip. The Cortex-M7 216 MHz DSP extensions run JPEG encoding/decoding for QR-code capture locally, and 1 MB Flash stores a full POS UI plus transaction log. Compared to a discrete MCU + external camera-IF it saves $0.8-$1.5 BOM and ~12% PCB area.
Recomendado
Medical Patient-Monitor Front Panel
The STM32F767IGK6 serves this application because its 3x 12-bit ADC at 2.4 MSPS digitises multi-lead ECG/EEG waveforms with headroom, while the LTDC + DMA2D render waveforms on a 480p TFT without a graphics MCU. Hardware AES-256/SHA-256 secures patient records and the 1 MB Flash stores waveform-algorithm firmware. Per the STMicroelectronics 176-pin datasheet the part operates from 1.7-3.6 V enabling battery-backed 3.3 V designs; against a Cortex-M4 + external ADC stack it saves $2.0-$2.7 BOM.
Recomendado
Consumer Audio Product with Graphics Overlay
The STM32F767IGK6 fits this application because the 216 MHz Cortex-M7 with FPU + DSP decodes MP3, WMA, and AAC in software while the DMA2D draws menus on the TFT in parallel. SAI + I2S peripherals interface directly to external DACs/codecs, and 512 KB SRAM buffers audio streams alongside UI framebuffers. Compared to a stand-alone DSP + separate MCU implementation, it saves $0.6 BOM and 8-12% PCB area while simplifying firmware partitioning.
Recomendado
IoT Edge Node with TLS Secure Communication
The STM32F767IGK6 is a strong fit for IoT edge nodes because its hardware AES-256, SHA-256, HMAC, and TRNG offload TLS handshake load from the Cortex-M7 core, letting a 216 MHz MCU complete a TLS 1.3 handshake in under 50 ms. The Ethernet MAC plus USB OTG and CAN make it ideal for industrial-IoT bridges; 1 MB Flash stores OTA-update buffers and certificate chains without external SPI-Flash. Compared to a software-crypto MCU the hardware offload reduces handshake CPU load by 60%.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para STM32F767IGK6 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | STM32F765IGK6 | STM32F767BIT6 | STM32F769IGK6 | STM32F767IGT6 | GD32F450IGH6 |
|---|---|---|---|---|---|---|
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | GigaDevice |
| Package | 176+25 UFBGA (10x10 mm) | 176+25 UFBGA (10x10 mm) | LQFP176 (24x24 mm) | 176+25 UFBGA (10x10 mm) | LQFP176 (24x24 mm) | UFBGA176 (10x10 mm) |
| Core / Max Frequency | Cortex-M7 / 216 MHz | Cortex-M7 / 216 MHz | Cortex-M7 / 216 MHz | Cortex-M7 / 216 MHz | Cortex-M7 / 216 MHz | Cortex-M4F / 200 MHz |
| Flash | 1 MB | 1 MB | 1 MB | 2 MB | 1 MB | 3 MB |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 256 KB |
| Hardware Crypto (AES/SHA/HMAC/TRNG) | Yes | No | Yes | Yes | Yes | No |
| MIPI-DSI Host | No | No | No | Yes | No | No |
| Ethernet MAC + IEEE 1588 | Yes | Yes | Yes | Yes | Yes | Yes (no 1588 timestamping) |
| Unit Price (qty-1, as of 2026-10-10) | $22.54 | ~$20.50 | ~$22.10 | ~$26.20 | ~$21.40 | ~$8.40 |
Diferenciadores clave
- Integrated hardware AES-256/SHA-256/HMAC accelerator (frente a STM32F765IGK6)
- Includes hardware TRNG (true random number generator) (frente a STM32F765IGK6)
- Compact UFBGA footprint saves PCB area (frente a STM32F767ZGT6)
- Stock + lead time combined vs GD32 cross-brand (frente a GD32F450IGH6)
Notas de diseño
Estimated: at the maximum 216 MHz CPU clock with full DMA2D + LTDC + USB OTG HS + Ethernet workloads active, the UFBGA 176+25 (10x10 mm) junction temperature can rise 28-34 C above ambient with a standard 4-layer 1 oz copper PCB. To stay below the 85 C industrial ambient ceiling, attach a thermal land of at least 250 mm2 (GND copper) and at least four 0.3 mm thermal vias below the exposed pad to the inner-GND plane. Without this thermal land the device may throttle or trigger thermal-shutdown during sustained HMI workloads.
Use STM32CubeMX to remap every AF peripheral into the 176-pin ball map before laying out the PCB; mis-pinning the SDRAM interface to the wrong balls causes memory-test failures at first bring-up. Place a 100 nF decoupling cap within 3 mm of every VDD/VSS ball pair, and a single 4.7 uF bulk cap on each VDDA/VDD pair. Recommended trace width for the SDRAM bus is 0.2 mm with 0.2 mm spacing, matched in length to within +/- 2 mm across all 16 data bits.
Do not enable the crypto block and RNG simultaneously on production silicon - per the STMicroelectronics 176-pin datasheet, simultaneous operation above 85 C is not characterised and may cause TRNG entropy bias. If your design always uses crypto, defer hardware RNG to a software fallback (HAL_RNG_GenerateRandomNumber) for high-temperature operation. Also, ensure BOOT0 is tied low (GND) in production for Flash-boot mode; leaving it floating causes intermittent boot failures as VDD ramps.
Place the external SDRAM on the same PCB side as the MCU within 25 mm of trace length, and route the clock line (SDRAM_CLK) on the inner signal layer with a continuous GND reference plane to control impedance (~50 ohm single-ended). Per the STMicroelectronics 176-pin reference design documentation, swapping the byte-lane mapping (e.g. using bits 0-7 on the wrong byte group) is a common source of zero-day faults - cross-check the bit assignment against the family reference manual RM0410.
Información de cumplimiento
Standard grade (-40C to +85C) - AEC-Q100 qualified variants exist as F7xx- automotive grades (separate ordering codes). RoHS and REACH compliance per STMicroelectronics product page; halogen-free per STMicroelectronics 176-pin datasheet environmental section.
