STM32H757XIH6 vs STM32H755ZIT6 Comparación
Comparación detallada lado a lado de STM32H757XIH6 por STMicroelectronics y STM32H755ZIT6 por STMicroelectronics. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
STMicroelectronics
STM32H757XIH6 - Dual-Core M7/M4 MCU, 2MB Flash, TFBGA-240 | STMicroelectronics
STM32H757XIH6 ✓ ActivoSTMicroelectronics
STM32H755ZIT6 - Dual-Core Cortex-M7/M4 MCU, 2MB Flash | STMicroelectronics
STM32H755ZIT6 ✓ ActivoComparación de especificaciones
| Parámetro | STM32H757XIH6 | STM32H755ZIT6 |
|---|---|---|
| Marca | STMicroelectronics | STMicroelectronics |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $12,18 | $16,19 |
| Architecture | Arm Cortex-M7 + Cortex-M4 (dual-core, asymmetric multiprocessing) | — |
| Cortex-M7 Max Clock | 480 MHz | — |
| Cortex-M4 Max Clock | 240 MHz | — |
| Flash Memory | 2 MB (dual-bank, read-while-write) | 2 MB (dual-bank) |
| SRAM | 1 MB (multiple banks incl. DTCM, AXI SRAM, SRAM1-4, Backup SRAM) | 1 MB (DTCM + AXI + SRAM1/2/3) |
| Supply Voltage (VDD) | 1.62 V to 3.6 V | — |
| Encapsulado | TFBGA-240 (14x14 mm, 0.8 mm pitch) plus 25 additional balls (240+25) | LQFP-144 (20x20 mm) |
| Temperatura de funcionamiento | -40 °C to +85 °C (grade 6) | -40 °C to +85 °C (industrial grade) |
| Communication Interfaces | 46 com. and analog interfaces incl. Ethernet, USB, CAN-FD, USART/UART, SPI, I2C, SAI | Ethernet, USB OTG HS/FS, 2x CAN FD, 6x SPI, 4x I2C, USART/UART, SDMMC, SAI |
| Display Interface | MIPI-DSI host controller + TFT-LCD controller | — |
| Crypto Accelerator | AES, hash (SHA-1/SHA-2), TRNG | — |
| Graphics Accelerator | Chrom-ART (2D DMA2D) | — |
| Camera Interface | DCMI (parallel, 8- to 14-bit) | — |
| External Memory Controller | FMC for SDRAM, NOR, NAND, PSRAM | — |
| Internal SMPS | Yes (voltage scaling for core) | Yes (step-down for core) |
| ADCs / DACs | Multiple 12-/16-bit ADCs; DAC channels [DATA_NEEDED: exact count] | — |
| Tipo de montaje | Surface Mount (TFBGA) | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Core Architecture | — | Dual-core Arm Cortex-M7 + Cortex-M4 |
| Cortex-M7 Max Frequency | — | 480 MHz |
| Cortex-M4 Max Frequency | — | 240 MHz |
| GPIO Count | — | 114 |
| Supply Voltage VDD | — | 1.62 V to 3.6 V |
| ADC | — | 3 x 16-bit, up to 3.6 MSPS |
| DAC | — | 2 x 12-bit |
| Graphics | — | Chrom-ART Accelerator, LCD-TFT controller, JPEG codec |
| Crypto Accelerators | — | AES, SHA, RSA, TRNG |
| Process Node | — | 40 nm CMOS |
| Nivel MSL | — | 3 (per JEDEC J-STD-020) |