T2081NXN8MQB vs T2081NXE8MQB Comparación
Comparación detallada lado a lado de T2081NXN8MQB por NXP Semiconductors y T2081NXE8MQB por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
T2081NXE8MQB - QorIQ T2 8x 1.2GHz MPU, 2x10GE, Crypto | NXP
T2081NXE8MQB ✓ ActivoComparación de especificaciones
| Parámetro | T2081NXN8MQB | T2081NXE8MQB |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $318,50 | $215,50 |
| Family | QorIQ T2 | — |
| Core Architecture | Power Architecture e6500 (64-bit) | — |
| Number of Cores | 4 physical cores / 8 virtual threads (dual-threaded SMT) | — |
| Core Frequency | 1.2 GHz | — |
| Memory Controller | DDR3 / DDR3L with ECC, up to 1.6 GT/s | DDR3/DDR3L, 64-bit, 1.6 GT/s, with ECC |
| Ethernet | 2x 10 Gigabit Ethernet | — |
| Cryptographic Acceleration | Disabled (no-crypto part) | — |
| Process Technology | 28 nm | — |
| Temperatura de funcionamiento | -40C to +105C (industrial) | — |
| Encapsulado | 780-ball FCBGA, 25 x 25 mm | — |
| Terminal Form | Ball (BGA) | — |
| Number of Terminals | 780 | — |
| Package Shape / Type | Square, FCPBGA | — |
| Temperature Grade | Industrial | — |
| Estado RoHS | Compliant | — |
| Data Sheet Revision | Rev 1.1 | — |
| Series | — | QorIQ T2 |
| Processor Core | — | Power Architecture e6500 (4 cores, dual-threaded) |
| Architecture | — | 64-bit |
| Core Clock Frequency | — | 1.2 GHz |
| Virtual Thread Count | — | 8 (4 cores x 2 threads) |
| Process Node | — | 28 nm CMOS |
| 10 Gigabit Ethernet | — | 2x 10GE MACs integrated |
| Cryptography | — | SEC 5.x hardware acceleration (crypto enabled) |
| Pin/Package Count | — | 780 pins |
| Package Type | — | FCPBGA (Flip-Chip Plastic BGA), 25x25 mm |
| Rango de temperatura de funcionamiento | — | -40C to +105C |
| Tipo de montaje | — | Surface Mount (BGA) |
| Tray Packaging | — | Tray (per FindIC listing) |
| Revision | — | Rev 1.1 |
| RoHS Compliance | — | Compliant (per NXP product page standard declarations) |