XA7Z020-1CLG400Q vs XC7Z010-1CLG400C Comparación
Comparación detallada lado a lado de XA7Z020-1CLG400Q por AMD y XC7Z010-1CLG400C por AMD. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | XA7Z020-1CLG400Q | XC7Z010-1CLG400C |
|---|---|---|
| Marca | AMD | AMD |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $132,10 | $0,00 |
| Device Family | Zynq-7000 XA | — |
| FPGA Fabric | Artix-7 | — |
| Number of Logic Cells | 85K | — |
| Number of LUTs | 53,200 | — |
| Processor | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| Processor Max Frequency | 667 MHz (-1 speed grade) | — |
| Total Block RAM | 560 Kbit | — |
| DSP Slices | 220 (DSP48E1) | 80 dedicated DSP slices |
| User I/O Count | 200 | — |
| Transceivers | 4 (up to 6.25 Gb/s) | — |
| Hard Memory Controller | 32-bit DDR3/DDR3L | — |
| Hard PCIe | Gen2 x4 | — |
| Temperatura de funcionamiento | -40C to +100C (AEC-Q100 Grade 2) | [DATA_NEEDED: operating temperature range] |
| Encapsulado | 400-ball CSPBGA (CLG400), 17x17 mm, 0.8 mm pitch | 400-CSBGA |
| Automotive Qualification | AEC-Q100 Grade 2 | — |
| Process Node | 28 nm HPL | — |
| Tipo de montaje | Surface Mount (BGA) | — |
| Estado RoHS | Compliant | — |
| Speed Grade | -1 (slowest) | — |
| Lead Free | Yes | — |
| Product Type | — | Zynq-7000 All Programmable System on Chip |
| Processor Core | — | Dual Arm Cortex-A9 MPCore |
| Processor Frequency | — | 667 MHz |
| FPGA Logic Cells | — | 28,000 cells |
| Registers | — | 35,200 registers |
| Block RAM | — | 60 block RAMs |
| Block RAM Capacity | — | 240 Kbit |
| Multipliers | — | 80 multipliers (18x25) |
| Ethernet MACs | — | 2 Ethernet MACs |
| Maximum User I/O | — | 128 I/Os |
| Process Technology | — | 28 nm |
| Differential I/O Standards | — | LVDS, SSTL, and HSTL |
| Package Dimensions | — | 17 mm x 17 mm |
| Architecture | — | MCU and FPGA |
| CoreSight Support | — | CoreSight |