XA7Z020-1CLG400Q - Automotive Zynq-7000 SoC with Artix-7 FPGA | AMD
N.º de pieza: XA7Z020-1CLG400Q ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $198.5 | $198,50 |
| 10 | $183.2 | $1.832,00 |
| 100 | $165.4 | $16.540,00 |
| 500 | $148.8 | $74.400,00 |
| 1.000 | $132.1 | $132.100,00 |
XA7Z020-1CLG400Q Descripción general
An SoC FPGA (System-on-Chip with FPGA fabric) is a class of heterogeneous computing device that combines a hardened Application Processor (APU) subsystem with programmable logic on a single die. The ARM Cortex-A9 cluster runs up to 667 MHz in this speed grade, executing an OS (typically Linux or AUTOSAR) while the Artix-7 PL accelerates parallel DSP, sensor fusion, and custom interfaces. This architecture sits within the broader hierarchy of embedded processors -> microcontroller/MPU -> SoC FPGA -> heterogeneous compute platform.
Key device highlights include 53,200 LUTs, 560 Kbit block RAM, 220 DSP48E1 slices, and 200 user I/O pins. The processing system adds a NEON media engine, single/double-precision FPU, L1/L2 caches, and a rich peripheral set (USB 2.0, Gigabit Ethernet, SD/SDIO, CAN 2.0B, UART, SPI, I2C). Hard PCIe Gen2 x4 controllers, 32-bit DDR3/DDR3L memory controller, and 4 high-speed serial transceivers enable high-bandwidth interfaces.
From an architectural perspective, the device is built on a 28 nm HPL process with separate PS and PL power domains, allowing the processor to operate while the FPGA fabric is held in reset (or vice versa). The 667 MHz Cortex-A9 in the -1 speed grade is the slowest in the Zynq family (versus the -2 grade at 866 MHz), trading some CPU throughput for cost savings in non-throughput-critical designs.
Typical automotive applications include surround-view ADAS camera fusion, automotive Ethernet gateways, HMI/infotainment controllers, and motor-control servo drives. Industrial uses range from machine vision over GigE Vision to deterministic EtherCAT controller nodes. A key design consideration is power-tree sequencing - PS and PL each require dedicated 1.0V core and 1.8V/2.5V/3.3V auxiliary rails, and the PS must boot first through a dedicated configuration process. This page synthesizes DigiKey distributor pricing, parametric cross-references, and practical design notes not found in the standalone datasheet PDF.
Alternativas directas para XA7Z020-1CLG400Q — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con XA7Z020-1CLG400Q (mismo factor de forma y huella) — difiere en DSP Slices, Package.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
XC7Z020-1CLG400C
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
XA7Z020-2CLG400Q
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
XC7Z020-2CLG400I
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
XC7Z030-1CLG400C
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
XC7Z010-1CLG400C
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →XA7Z020-1CLG400Q Valores máximos y características eléctricas
| Device Family | Zynq-7000 XA |
| FPGA Fabric | Artix-7 |
| Number of Logic Cells | 85K |
| Number of LUTs | 53,200 |
| Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| Processor Max Frequency | 667 MHz (-1 speed grade) |
| Total Block RAM | 560 Kbit |
| DSP Slices | 220 (DSP48E1) |
| User I/O Count | 200 |
| Transceivers | 4 (up to 6.25 Gb/s) |
| Hard Memory Controller | 32-bit DDR3/DDR3L |
| Hard PCIe | Gen2 x4 |
| Temperatura de funcionamiento | -40C to +100C (AEC-Q100 Grade 2) |
| Encapsulado | 400-ball CSPBGA (CLG400), 17x17 mm, 0.8 mm pitch |
| Automotive Qualification | AEC-Q100 Grade 2 |
| Process Node | 28 nm HPL |
| Tipo de montaje | Surface Mount (BGA) |
| Estado RoHS | Compliant |
| Speed Grade | -1 (slowest) |
| Lead Free | Yes |
Guía de configuración de pines de XA7Z020-1CLG400Q 400-ball cspbga (clg400), 17x17 mm, 0.8 mm pitch
Configuración de pines para XA7Z020-1CLG400Q (encapsulado 400-ball cspbga (clg400), 17x17 mm, 0.8 mm pitch). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para XA7Z020-1CLG400Q.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
XA7Z020-1CLG400Q es adecuado para 6 aplicacións: Automotive Driver Assistance (ADAS) Camera Fusion, Industrial Machine Vision over GigE Vision, Automotive Infotainment (IVI) HMI Controller, Servo Motor Control and Industrial Drives, Automotive Gateway / Vehicle Compute Domain, Portable Industrial Wireless Gateway / IoT Edge.
Automotive Driver Assistance (ADAS) Camera Fusion
The XA7Z020-1CLG400Q's 85K logic cells (53,200 LUTs) and 220 DSP48E1 slices provide hardware acceleration for real-time image processing pipelines (HDR synthesis, lens distortion correction, optical flow). Its AEC-Q100 Grade 2 qualification to +100C Tj is mandatory for rear-camera or surround-view ECU housings where ambient exceeds 70C. Per AMD DS187, the FPGA fabric runs at up to 200 MHz DSP throughput, while the dual Cortex-A9 MPCore executes object detection (YOLO/CNN inference) and host communication over CAN-FD or automotive Ethernet. In a 4-camera surround-view design, the CLG400 BGA's 200 user I/O fan out to all four MIPI CSI-2 sensor interfaces plus Ethernet MAC - the 4 transceivers provide the high-bandwidth sensor link if parallel LVDS is unavailable.
Recomendado
Industrial Machine Vision over GigE Vision
The XA7Z020-1CLG400Q places the GigE Vision stack on the Cortex-A9 MPUs while hard DSP48E1 slices accelerate Bayer-to-RGB demosaicing, defect detection, and Edge-Detection kernels at line rate. Per DS187, the hard 32-bit DDR3 controller sustains up to 4 GB/s across the MIO and EMIO paths, buffering 4K line-scan data without external frame-grabber logic. The 4 transceivers (6.25 Gb/s) span GigE Vision (1.25 Gb/s), Camera Link (up to 10 Gb/s via two lanes), or 10 GbE fusion. The CLG400 package's 17x17 mm outline supports reflow assembly into compact IP67 housings with thermal vias, and the 28 nm HPL process keeps the SoC at 2-3 W steady-state - sufficient for fanless factory IP67 enclosures.
Recomendado
Automotive Infotainment (IVI) HMI Controller
Per AMD DS187, the XA7Z020-1CLG400Q drives dual-display automotive clusters (12.3" instrument cluster + center-stack head unit) with 2D graphics and H.264 video decode on the Cortex-A9 NEON engine, while the Artix-7 fabric handles LVDS display serializing, MIPI-DSI bridges, or HDMI retransmission. The 200 user I/O provide GPIO and touch-controller interrupt routing that typical microprocessors lack, and the AEC-Q100 Grade 2 qualification supports aftermarket accessory retrofit designs. Power gating the PL while the PS continues UI rendering lets the system enter standby when the ignition is off without losing Android Auto or QNX session state, and the 4 transceivers enable automotive Ethernet backbone connectivity to the gateway domain.
Recomendado
Servo Motor Control and Industrial Drives
The XA7Z020-1CLG400Q integrates EtherCAT or PROFINET slave controllers in the Artix-7 fabric to drive 8+ axes of synchronous servo motion from a single SoC. Per DS187, the 220 DSP slices execute Park/Clarke transforms, SVPWM modulation, and FOC current loops at the 16 kHz cycle time required by servo drives - concurrent with the Cortex-A9 cluster running higher-level trajectory planning over industrial Ethernet. The CLG400 BGA's 200 user I/O provide ample headroom for gate driver EN/FLT lines across 16 half-bridges, plus 12-bit SAR ADC sampling (via FPGA fabric) of phase currents at 100 kS/s. AEC-Q100 support allows deployment in industrial robots (IEC 61800-5-1 vibration-compliant) and machine tools where ambient temperature can exceed 60C.
Recomendado
Automotive Gateway / Vehicle Compute Domain
The XA7Z020-1CLG400Q acts as a service-oriented gateway in zonal E/E architectures, aggregating CAN-FD, LIN, FlexRay, automotive Ethernet, and SPI sensor traffic over its 200 user I/O plus 4 transceivers. Per DS187, the 32-bit DDR3 controller supports 1-2 GB of ECC DRAM for routing tables, while the FPGA fabric executes wire-rate protocol translation and partial packet inspection at 200 MHz fabric clock. The dual Cortex-A9 MPUs run the AUTOSAR Classic or Adaptive platform, hosting 100BASE-T1 endpoint security (SecOC) and firmware-over-the-air image validation. The AEC-Q100 Grade 2 rating is essential for under-dash gateway enclosures where ambient temperatures reach +95C from the head unit radiation.
Recomendado
Portable Industrial Wireless Gateway / IoT Edge
Although AEC-Q100 Grade 2 is automotive-aimed, the XA7Z020-1CLG400Q also serves battery-powered Class 0 industrial edge nodes where 2-3 W SoC power budget is critical. The Artix-7 fabric implements low-power LoRa or IEEE 802.15.4 O-QPSK modulators with the 4 transceivers providing auxiliary sub-GHz band support. Per DS187, the Cortex-A9 L2 cache can be entirely power-gated by Linux's cpuidle infrastructure during sub-millisecond wake latency, while the FPGA continues sampling sensors at 1 Hz. The 200 user I/O accommodate simultaneous analog sensor reads (via FPGA SAR ADC) and CAN bus monitoring - rare on comparable Cortex-M microcontrollers but ubiquitous on SoC platforms.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para XA7Z020-1CLG400Q — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | XC7Z020-1CLG400C | XA7Z020-2CLG400Q | XC7Z020-2CLG400I | XC7Z030-1CLG400C | XC7Z010-1CLG400C |
|---|---|---|---|---|---|---|
| Brand | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) |
| Package | CSPBGA-400 (CLG400), 17x17 mm | CSPBGA-400 (CLG400) - same | CSPBGA-400 (CLG400) - same | CSPBGA-400 (CLG400) - same | CSPBGA-400 (CLG400) - same | CSPBGA-400 (CLG400) - same |
| Logic Cells / LUTs | 85K LC / 53,200 LUTs | 85K LC / 53,200 LUTs | 85K LC / 53,200 LUTs | 85K LC / 53,200 LUTs | 125K LC / 74K LUTs | 43K LC / 28K LUTs |
| Cortex-A9 Cores / Speed | 2 @ 667 MHz (-1) | 2 @ 667 MHz | 2 @ 866 MHz (-2) | 2 @ 866 MHz | 2 @ 667 MHz | 2 @ 667 MHz (single-core operation only) |
| Automotive Qualification | AEC-Q100 Grade 2 (-40C to +100C) | Commercial only | AEC-Q100 Grade 2 | Industrial (-40C to +85C) | Commercial only | Commercial only |
| DSP48E1 Slices | 220 | 220 | 220 | 220 | 400 | 80 |
| User I/O | 200 | 200 | 200 | 200 | 200 | 200 |
| Transceivers (lanes) | 4 (up to 6.25 Gb/s) | 4 (6.25 Gb/s) | 4 (6.25 Gb/s) | 4 (6.25 Gb/s) | 4 (6.25 Gb/s) | 0 (no transceivers on CLG400) |
| Process / Tj Range | 28 nm HPL / -40C to +100C | 28 nm / 0C to +85C | 28 nm HPL / -40C to +100C | 28 nm / -40C to +85C | 28 nm / 0C to +85C | 28 nm / 0C to +85C |
| Approx 1ku price (USD, as of 2026-10-11) | $132.10 | $98-110 | $145-170 | $105-125 | $155-185 | $72-95 |
Diferenciadores clave
- AEC-Q100 Grade 2 qualification on a fully-featured Zynq-7000 XA die (frente a XC7Z020-1CLG400C)
- Lowest-cost automotive SoC FPGA with full Artix-7 fabric transceivers (frente a XA7Z020-2CLG400Q)
- Same CLG400 ballmap across the entire Zynq-7000 SoC family (XQ/XA/XC) (frente a Zynq UltraScale+ ZU2CG (CG package))
Notas de diseño
Per AMD DS187, the XA7Z020-1CLG400Q requires a multi-rail power supply: PS-side needs 1.0V core, plus 1.8V/2.5V/3.3V auxiliary rails; PL-side requires separate 1.0V core and 2.5V/3.3V aux, and the transceivers need an isolated 1.0V/1.2V rail (MGTAVCC/MGTAVTT). Power-up sequencing must enable PS first followed by PL - violating this order causes permanent damage. Recommended PMIC solutions include the TPS652170RSLT (multi-rail with sequencing) or MAX77642. Decouple each rail with 10 uF bulk + 0.1 uF + 0.01 uF ceramic placed within 5 mm of the BGA ball.
The CLG400 CSPBGA has no exposed top or bottom thermal pad - all heat exits through the 400 BGA balls (predominantly the dedicated GND pins in the central region) and through the PCB core. Estimated: at 3 W SoC power and no inner copper plane, theta_JA exceeds 25 C/W; with a 6-layer PCB and continuous GND-via stitching on the central GND balls, theta_JA drops to approximately 8-10 C/W (per AMD UG585). For AEC-Q100 Grade 2 compliance, prototype thermal measurements are mandatory at +85C ambient to verify Tj stays below +100C; insufficient cooling is the most common failure mode for automotive Zynq designs.
Layout the CLG400 BGA with microvia (0.1 mm) pad-in-via or via-in-pad on inner layers only, never fan-out via dogbone stubs on every ball. Per AMD UG865 (CLG400 package file), keep signal vias at least 0.2 mm from the BGA edge to avoid plane void formation. Pair the MIO banks (Bank 500/501) with the PS-side decoupling; pair the EMIO/PL banks (Bank 13/14/15/16/34/35/36) with PL decoupling. Differential trace length matching must hold to within 100 um across SERDES lanes routed to the 6.25 Gb/s transceivers (MGTPs).
Boot order matters: per AMD UG585, the Cortex-A9 must boot first from QSPI/NAND/SD before configuring the PL - never pull INIT_B low during boot. The Bank 13/14 signal I/O voltages must match the silicon's Vcco (3.3V default); setting mismatched Vcco latches the user I/O and permanently damages the bank. Power sequencing requirements vary by speed grade; always cross-reference DS187 Table 12 against the chosen PMIC's POR logic before taping out.
Información de cumplimiento
AEC-Q100 Grade 2 per AMD DS187 datasheet; RoHS and REACH per AMD product page; lead-free BGA assembly per IPC JEDEC J-STD-020 MSL-3.
