XC6SLX75-2FG484C vs XC6SLX75-2FGG484I Comparación
Comparación detallada lado a lado de XC6SLX75-2FG484C por AMD y XC6SLX75-2FGG484I por AMD. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
AMD
XC6SLX75-2FGG484I - Spartan-6 LX FPGA, 74K Logic Cells, 484-BGA | AMD
XC6SLX75-2FGG484I ✓ ActivoComparación de especificaciones
| Parámetro | XC6SLX75-2FG484C | XC6SLX75-2FGG484I |
|---|---|---|
| Marca | AMD | AMD |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Unknown | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $82,10 |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| FPGA Family | Spartan-6 LX | — |
| Internal Frequency | 667 MHz | — |
| Logic Cells | 74,637 cells | 74,637 |
| Configurable Logic Blocks | 5,831 CLBs | — |
| Package Type | 484-BBGA, MS-034 FBGA | — |
| Package Dimensions | 23 x 23 mm | — |
| Package Pitch | 1 mm | — |
| Number of Balls | 484 balls | — |
| Temperatura de funcionamiento | 0 to 85 C | — |
| Speed Grade | -2 | -2 (mid-range) |
| Temperature Grade | Commercial | — |
| Process Technology | CMOS | 45 nm CMOS |
| Tipo de montaje | Surface mount ball grid array | Surface Mount (BGA) |
| Configuration | [DATA_NEEDED: configuration architecture] | — |
| Tensión de alimentación | [DATA_NEEDED: supply voltage] | — |
| Block RAM | [DATA_NEEDED: block RAM] | 4,824 Kbits (180 x 18 Kbit) |
| DSP Resources | [DATA_NEEDED: DSP resources] | — |
| User I/O | [DATA_NEEDED: user I/O count] | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Device Family | — | Spartan-6 LX |
| Logic Elements / Slices | — | 11,650 slices |
| System Gates | — | 3,170,304 |
| DSP Slices (DSP48A1) | — | 132 |
| User I/Os | — | 280 |
| Maximum Internal Frequency | — | 667 MHz |
| Core Supply Voltage (VCCINT) | — | 1.14 V to 1.26 V |
| Auxiliary Supply Voltage (VCCAUX) | — | 3.3 V |
| Encapsulado | — | 484-ball FBGA (FGG484), 23 x 23 mm, 1.0 mm pitch |
| Operating Temperature (Industrial) | — | -40 °C to +100 °C (junction to +125 °C) |
| Nivel MSL | — | 3 (168 hours) |