XC6SLX9-2FT256C vs XC6SLX9-2FTG256C Comparación
Comparación detallada lado a lado de XC6SLX9-2FT256C por AMD y XC6SLX9-2FTG256C por AMD. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | XC6SLX9-2FT256C | XC6SLX9-2FTG256C |
|---|---|---|
| Marca | AMD | AMD |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Unknown | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $27,85 |
| Device Type | Field-Programmable Gate Array (FPGA) | — |
| FPGA Family | Spartan-6 LX | — |
| Logic Cells | 9,152 cells | — |
| I/O Count | 186 I/O | — |
| Internal Frequency | 667 MHz | — |
| Speed Grade | -2 | -2 (commercial) |
| Technology | 45 nm CMOS | — |
| Core Supply Voltage | 1.2 V | — |
| Package Type | FTBGA-256 | — |
| Package Dimensions | 17 mm × 17 mm | — |
| Package Pitch | 1 mm | — |
| Package Outline | MS-034 | — |
| Ball Count | 256 balls | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Rango de temperatura de funcionamiento | 0°C to 85°C | — |
| Temperature Grade | Commercial | — |
| Configuration | Programmable FPGA | — |
| Block RAM | [DATA_NEEDED: block RAM capacity] | — |
| DSP Resources | [DATA_NEEDED: DSP resource count] | — |
| I/O Standards | [DATA_NEEDED: supported I/O standards] | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant (lead-free FTBGA) |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Series | — | Spartan-6 LX |
| Device Logic Cells | — | 9,152 LE |
| Adaptive Logic Modules (ALMs) | — | 1,430 ALM |
| Configurable Logic Blocks (CLBs) | — | 715 CLB |
| Embedded Block RAM | — | 576 Kbits |
| Distributed RAM | — | 32 Kbits |
| DSP / Multiplier Blocks | — | 16 (18 x 18 multipliers) |
| Maximum User I/Os | — | 186 |
| Internal Performance | — | Up to 667 MHz |
| Process Technology | — | 45 nm low-power CMOS |
| Encapsulado | — | 256-ball FTBGA (FTG256), 17 x 17 mm, 1.0 mm pitch |
| Temperatura de funcionamiento | — | 0 C to 85 C (commercial) |
| Tensión de alimentación | — | 1.2 V core / 1.2 V-3.3 V I/O (per DS160) |
| Configuration Modes | — | SPI, JTAG, BPI, Master Serial |