XC6SLX9-2FT256C vs XC6SLX9-2FTG256C Comparaison
Comparaison détaillée côte à côte de XC6SLX9-2FT256C par AMD et XC6SLX9-2FTG256C par AMD. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | XC6SLX9-2FT256C | XC6SLX9-2FTG256C |
|---|---|---|
| Marque | AMD | AMD |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Unknown | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $0,00 | $27,85 |
| Device Type | Field-Programmable Gate Array (FPGA) | — |
| FPGA Family | Spartan-6 LX | — |
| Logic Cells | 9,152 cells | — |
| I/O Count | 186 I/O | — |
| Internal Frequency | 667 MHz | — |
| Speed Grade | -2 | -2 (commercial) |
| Technology | 45 nm CMOS | — |
| Core Supply Voltage | 1.2 V | — |
| Package Type | FTBGA-256 | — |
| Package Dimensions | 17 mm × 17 mm | — |
| Package Pitch | 1 mm | — |
| Package Outline | MS-034 | — |
| Ball Count | 256 balls | — |
| Type de montage | Surface Mount | Surface Mount (BGA) |
| Plage de température de fonctionnement | 0°C to 85°C | — |
| Temperature Grade | Commercial | — |
| Configuration | Programmable FPGA | — |
| Block RAM | [DATA_NEEDED: block RAM capacity] | — |
| DSP Resources | [DATA_NEEDED: DSP resource count] | — |
| I/O Standards | [DATA_NEEDED: supported I/O standards] | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | Compliant (lead-free FTBGA) |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Series | — | Spartan-6 LX |
| Device Logic Cells | — | 9,152 LE |
| Adaptive Logic Modules (ALMs) | — | 1,430 ALM |
| Configurable Logic Blocks (CLBs) | — | 715 CLB |
| Embedded Block RAM | — | 576 Kbits |
| Distributed RAM | — | 32 Kbits |
| DSP / Multiplier Blocks | — | 16 (18 x 18 multipliers) |
| Maximum User I/Os | — | 186 |
| Internal Performance | — | Up to 667 MHz |
| Process Technology | — | 45 nm low-power CMOS |
| Boîtier | — | 256-ball FTBGA (FTG256), 17 x 17 mm, 1.0 mm pitch |
| Température de fonctionnement | — | 0 C to 85 C (commercial) |
| Tension d'alimentation | — | 1.2 V core / 1.2 V-3.3 V I/O (per DS160) |
| Configuration Modes | — | SPI, JTAG, BPI, Master Serial |