XC7Z045-2FFG900I vs XC7Z100-2FF900I Comparación

Comparación detallada lado a lado de XC7Z045-2FFG900I por Desconocido y XC7Z100-2FF900I por AMD. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

XC7Z045-2FFG900I XC7Z045-2FFG900I

XC7Z045-2FFG900I

XC7Z045-2FFG900I
AMD
XC7Z100-2FF900I XC7Z100-2FF900I - Zynq-7000 444K SoC | AMD Xilinx

XC7Z100-2FF900I - Zynq-7000 444K SoC | AMD Xilinx

XC7Z100-2FF900I ✓ Activo

Comparación de especificaciones

Parámetro XC7Z045-2FFG900I XC7Z100-2FF900I
Marca — AMD
Categoría — FPGA & CPLD
Estado del ciclo de vida Activo
Device Type — Zynq-7000 Kintex-7 programmable system-on-chip
Processor Subsystem — Dual ARM Cortex-A9 MPCore
Processor Clock Rating — 800 MHz
FPGA Logic Cells — 444K logic cells
FPGA Family — Kintex-7
Encapsulado — 900-FCBGA, 31 mm x 31 mm
Package Pin Count — 900 pins
Device Speed Grade — -2
Temperature Grade — Industrial
Tipo de montaje — Surface mount
Integrated Programmable Logic — 444K Kintex-7 logic cells
Debug Support — ARM CoreSight debug resources
Design Toolchain — AMD FPGA and SoC development toolchain; exact version [DATA_NEEDED: design toolchain version]
Rango de temperatura de funcionamiento — [DATA_NEEDED: minimum and maximum operating temperature]
Number of High-Speed Transceivers — [DATA_NEEDED: transceiver count]
Maximum Transceiver Data Rate — [DATA_NEEDED: maximum transceiver data rate]
Programmable I/O Count — [DATA_NEEDED: programmable I/O count]
Memory Interface Details — [DATA_NEEDED: memory interface types and supported rates]
Power Supply Inputs — [DATA_NEEDED: supply rail names and voltage ranges]
Typical Power Consumption — [DATA_NEEDED: typical and maximum power consumption]
Estado RoHS — [DATA_NEEDED: RoHS compliance declaration]
REACH Status — [DATA_NEEDED: REACH compliance declaration]
Lead-Free Status — [DATA_NEEDED: lead-free packaging declaration]
AEC-Q100 Qualification — Not applicable; this is an FPGA and SoC rather than an automotive-grade discrete component
Package Thermal Resistance — [DATA_NEEDED: package thermal resistance]

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