XC7Z045-2FFG900I vs XC7Z100-2FF900I Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci XC7Z045-2FFG900I disebabkan oleh Tidak diketahui dan XC7Z100-2FF900I disebabkan oleh AMD. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | XC7Z045-2FFG900I | XC7Z100-2FF900I |
|---|---|---|
| Merek | — | AMD |
| Kategori | — | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | |
| Device Type | — | Zynq-7000 Kintex-7 programmable system-on-chip |
| Processor Subsystem | — | Dual ARM Cortex-A9 MPCore |
| Processor Clock Rating | — | 800 MHz |
| FPGA Logic Cells | — | 444K logic cells |
| FPGA Family | — | Kintex-7 |
| Kemasan | — | 900-FCBGA, 31 mm x 31 mm |
| Package Pin Count | — | 900 pins |
| Device Speed Grade | — | -2 |
| Temperature Grade | — | Industrial |
| Jenis Pemasangan | — | Surface mount |
| Integrated Programmable Logic | — | 444K Kintex-7 logic cells |
| Debug Support | — | ARM CoreSight debug resources |
| Design Toolchain | — | AMD FPGA and SoC development toolchain; exact version [DATA_NEEDED: design toolchain version] |
| Gambaran Suhu Operasi | — | [DATA_NEEDED: minimum and maximum operating temperature] |
| Number of High-Speed Transceivers | — | [DATA_NEEDED: transceiver count] |
| Maximum Transceiver Data Rate | — | [DATA_NEEDED: maximum transceiver data rate] |
| Programmable I/O Count | — | [DATA_NEEDED: programmable I/O count] |
| Memory Interface Details | — | [DATA_NEEDED: memory interface types and supported rates] |
| Power Supply Inputs | — | [DATA_NEEDED: supply rail names and voltage ranges] |
| Typical Power Consumption | — | [DATA_NEEDED: typical and maximum power consumption] |
| Status RoHS | — | [DATA_NEEDED: RoHS compliance declaration] |
| REACH Status | — | [DATA_NEEDED: REACH compliance declaration] |
| Lead-Free Status | — | [DATA_NEEDED: lead-free packaging declaration] |
| AEC-Q100 Qualification | — | Not applicable; this is an FPGA and SoC rather than an automotive-grade discrete component |
| Package Thermal Resistance | — | [DATA_NEEDED: package thermal resistance] |