10AS032E4F29E3LG - Arria 10 SX SoC FPGA 320K LE 780-FBGA | Intel
N.º de pieza: 10AS032E4F29E3LG ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $2850 | $2.850,00 |
| 10 | $2710 | $27.100,00 |
| 100 | $2580 | $258.000,00 |
| 500 | $2420 | $1.210.000,00 |
| 1.000 | $2295 | $2.295.000,00 |
10AS032E4F29E3LG Descripción general
Arria 10 SX SoC FPGAs occupy the SoC FPGA category, sitting hierarchically under FPGA & CPLD, programmable logic, and semiconductor devices. The Arria 10 family bridges mid-range Cyclone and high-end Stratix parts, targeting DSP-intensive and ARM-host-aggregated applications such as wireless baseband, industrial vision, and broadcast equipment. The SX variant uniquely combines ARM Cortex-A9 cores with FPGA fabric for hardware-accelerated processing, distinguishing it from GX (transceiver-focused) and GT (transceiver-rich) siblings.
Key features include 32 Gbps transceivers, hardware floating-point DSP blocks, hardened memory controllers, PCIe Gen3 x8, and up to 1.866 Gbps DDR4 external memory interfaces. The HPS block integrates dual ARM Cortex-A9 cores with NEON media engine, CoreSight debug, 32KB I-cache / 32KB D-cache per core, 512KB L2 shared cache, on-chip RAM, and rich peripherals (USB, GbE, UART, I2C, SPI, SD/MMC). Configuration is via quad-serial configuration flash; volatile SRAM cells require reconfiguration on every power-up.
Typical applications include 4K video processing pipelines, software-defined radio (SDR), motor control, test and measurement instrumentation, and high-performance embedded compute. The HPS runs Linux while the FPGA fabric accelerates latency-critical DSP, making the device attractive for heterogeneous compute tasks requiring both OS-level programmability and hardware throughput.
When designing, ensure a robust thermal solution: the 780-ball FCBGA dissipates up to approximately 25-30W at full utilization. TI recommends a multi-layer PCB with continuous ground/power planes under the device, and full ball-array solder attach using SAC305 lead-free paste per IPC J-STD-020 MSL3. JTAG and AS configuration modes must both be accessible for production programming.
This page synthesizes Intel/Altera authorized distributor pricing, drop-in Arria 10 family alternatives in the same F29 footprint, application-specific companion parts, and practical PCB thermal design guidance that goes beyond the datasheet alone.
Alternativas directas para 10AS032E4F29E3LG — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con 10AS032E4F29E3LG (mismo factor de forma y huella) — difiere en Package, Mounting Type, Logic Elements, RoHS Status, Operating Temperature Grade.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
10AS032E4F27E3LG
✅ Sustitución directa✓ En stock
$1950 / unidad
Ver hoja de datos →10AS032E4F29I3LG
✅ Sustitución directa✓ En stock
$1920 / unidad
Ver hoja de datos →10AS032E4F29E3SG
✅ Sustitución directa✓ En stock
$1920 / unidad
Ver hoja de datos →10AS048E4F29E3LG
✅ Sustitución directa✓ En stock
$1350 / unidad
Ver hoja de datos →10AS066E4F29E3LG
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
10AS022E3F29I2LG
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
10AS032E4F29E3LG Valores máximos y características eléctricas
| Family | Arria 10 SX |
| Product Type | SoC FPGA (HPS + FPGA fabric) |
| Logic Elements | 320,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Max Clock | 1.5 GHz |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Encapsulado | 780-FCBGA, FC (29x29 mm) |
| Tipo de montaje | Surface Mount (Flip-Chip BGA) |
| Temperatura de funcionamiento | 0C to +100C (commercial, E3 grade) |
| Speed Grade | -4 (transceiver/PLL performance) |
| Configuration Memory | SRAM-based, volatile |
| Configuration Mode | AS (quad-serial) / JTAG |
| Nivel MSL | MSL3 (per IPC J-STD-020) |
| Estado RoHS | Compliant (lead-free SAC305) |
Guía de configuración de pines de 10AS032E4F29E3LG 780-fcbga, fc (29x29 mm)
Configuración de pines para 10AS032E4F29E3LG (encapsulado 780-fcbga, fc (29x29 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para 10AS032E4F29E3LG.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
10AS032E4F29E3LG es adecuado para 7 aplicacións: Wireless Baseband Processing, Software Defined Radio (SDR), 4K Video Processing & Broadcast, Industrial Machine Vision, Test & Measurement Instrumentation, Aerospace & Defense Signal Processing, Medical Imaging Systems.
Wireless Baseband Processing
The 10AS032E4F29E3LG fits wireless baseband processing because its 320K logic elements and dual ARM Cortex-A9 HPS can run baseband DSP stacks alongside a Linux protocol stack on the same die. Its 32 Gbps transceivers connect directly to RF front-end ADCs/DACs at JESD204B/C rates, and the DDR4 controller streams up to 1.866 Gbps to external LPDDR4 memory. Hardened PCIe Gen3 x8 links to host baseband cards or co-processors. Compared with pure soft-processors, the HPS saves ~30K logic elements and ~3W of dynamic power for the same throughput. The F29 780-ball package exposes enough transceivers for 4T4R radio chains, making it ideal for small-cell and macro base station designs.
Recomendado
Software Defined Radio (SDR)
The 10AS032E4F29E3LG suits software defined radio platforms because its 320K LE deliver enough DSP blocks (~1,560 18x19 multipliers) for LTE/5G NR channelization, FFT/iFFT, and channel estimation. The ARM Cortex-A9 HPS runs GNU Radio or custom signal-processing stacks while the FPGA fabric accelerates latency-critical blocks. Its transceivers support ADC sampling rates up to 6 Gbps with deterministic latency. Compared with ASIC-only SDR, the FPGA approach enables rapid protocol updates. Use this device when prototyping multi-standard military or commercial radio systems requiring reconfiguration between waveforms.
Recomendado
4K Video Processing & Broadcast
The 10AS032E4F29E3LG fits 4K video processing because its 320K LE plus hardened memory controllers deliver sufficient bandwidth for 4K60p HEVC/H.264 encoding/decoding pipelines. The dual ARM HPS runs Linux for codec management and network streaming, while the FPGA fabric accelerates motion estimation, deinterlacing, and color-space conversion at line-rate. Its PCIe Gen3 x8 interface connects to host capture or display cards. Compared with discrete processor-plus-FPGA designs, the integrated SoC reduces BOM cost by ~25% and PCB area by ~40%. The device supports up to 12 SDI links via transceivers for broadcast studio routing.
Recomendado
Industrial Machine Vision
The 10AS032E4F29E3LG fits industrial machine vision because its SoC architecture consolidates image acquisition, preprocessing, and decision logic in one chip. The FPGA fabric accelerates Bayer demosaicing, lens distortion correction, and CNN inference at multi-megapixel rates, while the HPS runs Linux for PLC communication (EtherCAT, PROFINET) and HMI rendering. Its 320K LE accommodate 8-12 lanes of MIPI CSI-2 or parallel camera inputs. Compared with GPU-based vision systems, the Arria 10 SX reduces power per frame by ~60% while meeting deterministic latency requirements for quality-control inspection at >1000 parts per minute.
Recomendado
Test & Measurement Instrumentation
The 10AS032E4F29E3LG fits high-end test and measurement because its 320K LE and DSP blocks deliver real-time FFT and digital down-conversion at GHz sample rates. The ARM HPS runs the instrument OS, USB/LXI control stack, and display rendering, while the FPGA fabric implements custom trigger logic and DSP. Its transceivers accept up to 6 Gbps ADC data, and its PCIe Gen3 streams results to host CPU at multi-GB/s rates. Compared with discrete DSP+CPU solutions, this SoC FPGA shrinks PCB footprint and improves channel-to-channel synchronization. The 780-ball FCBGA provides ample user I/O for front-panel connectors and timing distribution.
Recomendado
Aerospace & Defense Signal Processing
The 10AS032E4F29E3LG fits defense signal processing because its SoC architecture reduces SWaP-C in radar, EW, and SIGINT systems. Its hardened ARM Cortex-A9 cores run secure RTOS or Linux while FPGA fabric handles beamforming, pulse compression, and direction-finding algorithms. Its transceivers support direct RF sampling to L-band/S-band, and its 320K LE accommodate multi-channel adaptive processing. Compared with VPX-based architectures, the SoC approach cuts board count and weight by ~50%. For mission-critical applications, use the I3 industrial temperature grade variant (10AS032E4F29I3LG) in the same F29 package for extended environmental tolerance.
Recomendado
Medical Imaging Systems
The 10AS032E4F29E3LG fits medical imaging because its 320K LE and DSP blocks handle ultrasound beamforming, CT reconstruction, and MRI signal processing at clinical frame rates. The ARM Cortex-A9 HPS runs the patient interface, DICOM stack, and security policies while FPGA fabric accelerates backprojection and FFT operations. Its PCIe Gen3 links to host display cards, and DDR4 memory bandwidth supports 4D volumetric data. Compared with GPU clusters, this SoC reduces cost and power while meeting deterministic latency for real-time imaging. The 780-ball FCBGA F29 package supports enough I/O for multi-probe ultrasound front-end arrays.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 10AS032E4F29E3LG — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | 10AS032E4F27E3LG | 10AS032E4F29I3LG | 10AS032E4F29E3SG | 10AS048E4F29E3LG | 10AS066E4F29E3LG | 10AS022E3F29I2LG |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FCBGA, FC (29x29 mm, F29) | 672-FCBGA (27x27 mm, F27) | 780-FCBGA, FC (29x29 mm, F29) - same | 780-FCBGA, FC (29x29 mm, F29) - same | 780-FCBGA, FC (29x29 mm, F29) - same | 780-FCBGA, FC (29x29 mm, F29) - same | 780-FCBGA, FC (29x29 mm, F29) - same |
| Logic Elements | 320,000 | 320,000 | 320,000 | 320,000 | 480,000 (+50%) | 660,000 (+106%) | 220,000 (-31%) |
| Speed Grade | -4 | -4 | -4 | -4 | -4 | -4 | -3 (lower performance) |
| Temperature Grade | E3 (0C to +100C commercial) | E3 (0C to +100C) | I3 (-40C to +100C industrial) | E3 (0C to +100C) | E3 (0C to +100C) | E3 (0C to +100C) | I2 (-40C to +100C industrial) |
| HPS Core Clock | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| RoHS Status | Compliant (lead-free) | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Diferenciadores clave
- Highest logic density at -4 speed grade in the F29 780-ball package (frente a 10AS022E3F29I2LG)
- Drop-in upgrade path to higher-density Arria 10 SX parts (frente a 10AS048E4F29E3LG)
- Integrated ARM Cortex-A9 HPS removes need for external processor (frente a 10AS032E4F27E3LG (same die, smaller F27 package))
Notas de diseño
Estimated: The 10AS032E4F29E3LG dissipates approximately 25-30W at full utilization of 320K LE plus HPS at 1.5 GHz. The 780-ball FCBGA requires a minimum 8-layer PCB stack-up with continuous ground and power planes under the device. Use a thermal interface material rated for 1-3 W/m-K between the package and heatsink, and aim for theta_JA below 5 C/W with forced-air cooling to keep junction temperature below 100C in the E3 commercial grade.
The 780-ball FCBGA F29 (29x29 mm, 1.0 mm ball pitch) demands IPC-6012 Class 3 manufacturing. Use HDI microvia stack-up with laser-drilled vias and 0.5 oz copper outer layers plus 1 oz inner layers. Solder paste stencil apertures should be 0.85 of ball diameter per IPC-7525. Reflow profile must comply with J-STD-020 MSL3 (260C peak, 60-90 seconds TAL). Place 100nF decoupling capacitors every 5mm along the FPGA perimeter, plus bulk 22uF/100uF capacitors near voltage regulator outputs.
Do not apply power to the 10AS032E4F29E3LG until all voltage rails (0.9V core, 1.1V transceiver, 1.8V/2.5V/3.3V I/O) are within 5% of nominal. Power sequencing must follow Intel's recommended order: VCC_HPS before VCC_FPGA, with PERST# held low until clocks are stable. Failing to sequence properly can trigger latch-up or permanent damage. Also: enable the HPS reset only after configuration completes - early reset can corrupt the boot ROM state machine.
The 32 Gbps transceivers require controlled-impedance differential routing at 100 ohm with maximum 4 dB insertion loss from FPGA pin to connector. Use stripline on inner layers with reference ground plane 5-8 mils below the trace. Series AC-coupling capacitors (100nF) must be placed near the FPGA pin. Length-match all differential pairs within 5 mils to avoid bit-error-rate degradation. Consult Intel's Transceiver Link Design Guide for eye-diagram compliance.
Place the configuration flash (MT25QL256BBB8E12-CAUT) within 3 inches of the FPGA's AS configuration pins to avoid signal-integrity issues on quad-serial interface. The JTAG chain should be routed with 50-ohm single-ended impedance and terminated with 10k pull-ups on TDO. HPS peripherals (USB, GbE, SD/MMC) require their own analog power islands with ferrite-bead isolation from digital 3.3V supply. Use IBIS-AMI simulation for DDR4 interfaces to validate timing margins at 1.866 Gbps.
Información de cumplimiento
RoHS compliant per Intel/Altera product page; lead-free SAC305 ball finish per Intel datasheet. Not AEC-Q100 qualified - not designed for automotive safety-critical applications. Halogen-free status not explicitly stated in available data.
