10AS032E4F29E3LG - Arria 10 SX SoC FPGA 320K LE 780-FBGA | Intel
MPN: 10AS032E4F29E3LG β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2710 | $27,100.00 |
| 100 | $2580 | $258,000.00 |
| 500 | $2420 | $1,210,000.00 |
| 1,000 | $2295 | $2,295,000.00 |
Drop-in alternatives for 10AS032E4F29E3LG β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
10AS032E4F27E3LG
β Drop-Inβ In Stock
$1950 / Unit
View Datasheet β10AS032E4F29I3LG
β Drop-Inβ In Stock
$1920 / Unit
View Datasheet β10AS032E4F29E3SG
β Drop-Inβ In Stock
$1920 / Unit
View Datasheet β10AS048E4F29E3LG
β Drop-Inπ Reference alternative (not in catalog)
10AS066E4F29E3LG
β Drop-Inπ Reference alternative (not in catalog)
10AS022E3F29I2LG
β Drop-Inπ Reference alternative (not in catalog)
10AS032E4F29E3LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX |
| Product Type | SoC FPGA (HPS + FPGA fabric) |
| Logic Elements | 320,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Max Clock | 1.5 GHz |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Package | 780-FCBGA, FC (29x29 mm) |
| Mounting Type | Surface Mount (Flip-Chip BGA) |
| Operating Temperature | 0C to +100C (commercial, E3 grade) |
| Speed Grade | -4 (transceiver/PLL performance) |
| Configuration Memory | SRAM-based, volatile |
| Configuration Mode | AS (quad-serial) / JTAG |
| MSL Level | MSL3 (per IPC J-STD-020) |
| RoHS Status | Compliant (lead-free SAC305) |
10AS032E4F29E3LG 780-fcbga, fc (29x29 mm) Pin Configuration Guide
Complete pinout information for 10AS032E4F29E3LG (780-fcbga, fc (29x29 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS032E4F29E3LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS032E4F29E3LG is suitable for 7 applications: Wireless Baseband Processing, Software Defined Radio (SDR), 4K Video Processing & Broadcast, Industrial Machine Vision, Test & Measurement Instrumentation, Aerospace & Defense Signal Processing, Medical Imaging Systems.
Wireless Baseband Processing
The 10AS032E4F29E3LG fits wireless baseband processing because its 320K logic elements and dual ARM Cortex-A9 HPS can run baseband DSP stacks alongside a Linux protocol stack on the same die. Its 32 Gbps transceivers connect directly to RF front-end ADCs/DACs at JESD204B/C rates, and the DDR4 controller streams up to 1.866 Gbps to external LPDDR4 memory. Hardened PCIe Gen3 x8 links to host baseband cards or co-processors. Compared with pure soft-processors, the HPS saves ~30K logic elements and ~3W of dynamic power for the same throughput. The F29 780-ball package exposes enough transceivers for 4T4R radio chains, making it ideal for small-cell and macro base station designs.
Recommended
Software Defined Radio (SDR)
The 10AS032E4F29E3LG suits software defined radio platforms because its 320K LE deliver enough DSP blocks (~1,560 18x19 multipliers) for LTE/5G NR channelization, FFT/iFFT, and channel estimation. The ARM Cortex-A9 HPS runs GNU Radio or custom signal-processing stacks while the FPGA fabric accelerates latency-critical blocks. Its transceivers support ADC sampling rates up to 6 Gbps with deterministic latency. Compared with ASIC-only SDR, the FPGA approach enables rapid protocol updates. Use this device when prototyping multi-standard military or commercial radio systems requiring reconfiguration between waveforms.
Recommended
4K Video Processing & Broadcast
The 10AS032E4F29E3LG fits 4K video processing because its 320K LE plus hardened memory controllers deliver sufficient bandwidth for 4K60p HEVC/H.264 encoding/decoding pipelines. The dual ARM HPS runs Linux for codec management and network streaming, while the FPGA fabric accelerates motion estimation, deinterlacing, and color-space conversion at line-rate. Its PCIe Gen3 x8 interface connects to host capture or display cards. Compared with discrete processor-plus-FPGA designs, the integrated SoC reduces BOM cost by ~25% and PCB area by ~40%. The device supports up to 12 SDI links via transceivers for broadcast studio routing.
Recommended
Industrial Machine Vision
The 10AS032E4F29E3LG fits industrial machine vision because its SoC architecture consolidates image acquisition, preprocessing, and decision logic in one chip. The FPGA fabric accelerates Bayer demosaicing, lens distortion correction, and CNN inference at multi-megapixel rates, while the HPS runs Linux for PLC communication (EtherCAT, PROFINET) and HMI rendering. Its 320K LE accommodate 8-12 lanes of MIPI CSI-2 or parallel camera inputs. Compared with GPU-based vision systems, the Arria 10 SX reduces power per frame by ~60% while meeting deterministic latency requirements for quality-control inspection at >1000 parts per minute.
Recommended
Test & Measurement Instrumentation
The 10AS032E4F29E3LG fits high-end test and measurement because its 320K LE and DSP blocks deliver real-time FFT and digital down-conversion at GHz sample rates. The ARM HPS runs the instrument OS, USB/LXI control stack, and display rendering, while the FPGA fabric implements custom trigger logic and DSP. Its transceivers accept up to 6 Gbps ADC data, and its PCIe Gen3 streams results to host CPU at multi-GB/s rates. Compared with discrete DSP+CPU solutions, this SoC FPGA shrinks PCB footprint and improves channel-to-channel synchronization. The 780-ball FCBGA provides ample user I/O for front-panel connectors and timing distribution.
Recommended
Aerospace & Defense Signal Processing
The 10AS032E4F29E3LG fits defense signal processing because its SoC architecture reduces SWaP-C in radar, EW, and SIGINT systems. Its hardened ARM Cortex-A9 cores run secure RTOS or Linux while FPGA fabric handles beamforming, pulse compression, and direction-finding algorithms. Its transceivers support direct RF sampling to L-band/S-band, and its 320K LE accommodate multi-channel adaptive processing. Compared with VPX-based architectures, the SoC approach cuts board count and weight by ~50%. For mission-critical applications, use the I3 industrial temperature grade variant (10AS032E4F29I3LG) in the same F29 package for extended environmental tolerance.
Recommended
Medical Imaging Systems
The 10AS032E4F29E3LG fits medical imaging because its 320K LE and DSP blocks handle ultrasound beamforming, CT reconstruction, and MRI signal processing at clinical frame rates. The ARM Cortex-A9 HPS runs the patient interface, DICOM stack, and security policies while FPGA fabric accelerates backprojection and FFT operations. Its PCIe Gen3 links to host display cards, and DDR4 memory bandwidth supports 4D volumetric data. Compared with GPU clusters, this SoC reduces cost and power while meeting deterministic latency for real-time imaging. The 780-ball FCBGA F29 package supports enough I/O for multi-probe ultrasound front-end arrays.
Recommended
Recommended Products Summary
Engineering reference data for 10AS032E4F29E3LG β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS032E4F27E3LG | 10AS032E4F29I3LG | 10AS032E4F29E3SG | 10AS048E4F29E3LG | 10AS066E4F29E3LG | 10AS022E3F29I2LG |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FCBGA, FC (29x29 mm, F29) | 672-FCBGA (27x27 mm, F27) | 780-FCBGA, FC (29x29 mm, F29) - same | 780-FCBGA, FC (29x29 mm, F29) - same | 780-FCBGA, FC (29x29 mm, F29) - same | 780-FCBGA, FC (29x29 mm, F29) - same | 780-FCBGA, FC (29x29 mm, F29) - same |
| Logic Elements | 320,000 | 320,000 | 320,000 | 320,000 | 480,000 (+50%) | 660,000 (+106%) | 220,000 (-31%) |
| Speed Grade | -4 | -4 | -4 | -4 | -4 | -4 | -3 (lower performance) |
| Temperature Grade | E3 (0C to +100C commercial) | E3 (0C to +100C) | I3 (-40C to +100C industrial) | E3 (0C to +100C) | E3 (0C to +100C) | E3 (0C to +100C) | I2 (-40C to +100C industrial) |
| HPS Core Clock | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| RoHS Status | Compliant (lead-free) | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- Highest logic density at -4 speed grade in the F29 780-ball package (vs 10AS022E3F29I2LG)
- Drop-in upgrade path to higher-density Arria 10 SX parts (vs 10AS048E4F29E3LG)
- Integrated ARM Cortex-A9 HPS removes need for external processor (vs 10AS032E4F27E3LG (same die, smaller F27 package))
Design Notes
Estimated: The 10AS032E4F29E3LG dissipates approximately 25-30W at full utilization of 320K LE plus HPS at 1.5 GHz. The 780-ball FCBGA requires a minimum 8-layer PCB stack-up with continuous ground and power planes under the device. Use a thermal interface material rated for 1-3 W/m-K between the package and heatsink, and aim for theta_JA below 5 C/W with forced-air cooling to keep junction temperature below 100C in the E3 commercial grade.
The 780-ball FCBGA F29 (29x29 mm, 1.0 mm ball pitch) demands IPC-6012 Class 3 manufacturing. Use HDI microvia stack-up with laser-drilled vias and 0.5 oz copper outer layers plus 1 oz inner layers. Solder paste stencil apertures should be 0.85 of ball diameter per IPC-7525. Reflow profile must comply with J-STD-020 MSL3 (260C peak, 60-90 seconds TAL). Place 100nF decoupling capacitors every 5mm along the FPGA perimeter, plus bulk 22uF/100uF capacitors near voltage regulator outputs.
Do not apply power to the 10AS032E4F29E3LG until all voltage rails (0.9V core, 1.1V transceiver, 1.8V/2.5V/3.3V I/O) are within 5% of nominal. Power sequencing must follow Intel's recommended order: VCC_HPS before VCC_FPGA, with PERST# held low until clocks are stable. Failing to sequence properly can trigger latch-up or permanent damage. Also: enable the HPS reset only after configuration completes - early reset can corrupt the boot ROM state machine.
The 32 Gbps transceivers require controlled-impedance differential routing at 100 ohm with maximum 4 dB insertion loss from FPGA pin to connector. Use stripline on inner layers with reference ground plane 5-8 mils below the trace. Series AC-coupling capacitors (100nF) must be placed near the FPGA pin. Length-match all differential pairs within 5 mils to avoid bit-error-rate degradation. Consult Intel's Transceiver Link Design Guide for eye-diagram compliance.
Place the configuration flash (MT25QL256BBB8E12-CAUT) within 3 inches of the FPGA's AS configuration pins to avoid signal-integrity issues on quad-serial interface. The JTAG chain should be routed with 50-ohm single-ended impedance and terminated with 10k pull-ups on TDO. HPS peripherals (USB, GbE, SD/MMC) require their own analog power islands with ferrite-bead isolation from digital 3.3V supply. Use IBIS-AMI simulation for DDR4 interfaces to validate timing margins at 1.866 Gbps.
Compliance Information
RoHS compliant per Intel/Altera product page; lead-free SAC305 ball finish per Intel datasheet. Not AEC-Q100 qualified - not designed for automotive safety-critical applications. Halogen-free status not explicitly stated in available data.
